IC Packaging services for Semiconix Semiconductor board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.
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semiconix semiconductor - where the future is today - gold chip technology LIST OF AVAILABLE PACKAGES
   

GOLD CHIP TECHNOLOGY™
 
LIST OF AVAILABLE PACKAGES
FCOL-FLIP CHIP ON LEAD FRAME      
PACKAGE TYPE LEAD COUNT BODY SIZE [mm] DIE SIZE [mils]
MLPM-5FC 5 2X2 63X63
MLPM-6FC 6 3X2 63X102
MLP - MICRO LEADFRAME PACKAGE
PACKAGE TYPE LEAD COUNT BODY SIZE [mm] DIE SIZE [mils]
MLP Micro 3/5 2x1  
  3/4/5/6/8 2x2  
  3/4/5/6/8 3x2  
  3/4/5/6/8/10 3x3  
MLP Quad/Dual - MICRO LEADFRAME PACKAGE
PACKAGE TYPE LEAD COUNT BODY SIZE [mm] DIE SIZE [mils]
MLP DUAL 6/8/10 3x3  
  12 4x3  
  8 (SOIC) 5x6  
  8/12/16 3 x 3  
  14 3.5 x 3.5  
  16 4 x 3.5  
  12/16/20/24 4 x 4  
  20 4.5 x 3.5  
  24 5 x 4  
  14/20/28/32 5 x 5  
  38 5 x 7  
  32 6 x 5  
  28/36/40 6 x 6  
  38 7 x 5  
  32/44/48 7x7  
  56 8x8  
  64 9x9  
SOT - SMALL OUTLINE TRANSISTOR
PACKAGE TYPE LEAD COUNT BODY SIZE [mm] DIE SIZE [mils]
SC70-3 3 STD 63X34
SC70-4 4 STD 63X34
SC70-5 5 STD 63X34
SC70-6 6 STD  
SC70-8 8 STD  
SOT23 3 STD  
SOT25 5 STD  
SOT26 6 STD  
SOT143 4 STD  
SC79 2    
SC90 3    
SOP - SMALL OUTLINE PACKAGE
PACKAGE TYPE LEAD COUNT BODY SIZE [mils] DIE SIZE [mils]
SOIC 8/14/16 150  
SOIC 16/18/20/24/28 300  
QSOP 16/20/24/28 150  
PACKAGE TYPE LEAD COUNT BODY SIZE [mm] DIE SIZE [mils]
SSOP 20/24/28 5.3  
TSSOP 8/14/16/20/24/28/38 4.4  
TSSOP 48/56 6.1  
MSOP 8/10 3.0  
PDIP (DIP) - Plastic Dual-In-Line Package
PACKAGE TYPE LEAD COUNT BODY SIZE [mils] DIE SIZE [mils]
PDIP 8/14/16/24 300  
PDIP 48 600  
LQFP-LOW QUAD FLAT PACK PACKAGE
PACKAGE TYPE LEAD COUNT BODY SIZE mm PITCH mm
LQFP-32 32 7X5 0.50
LQFP-32 32 7X7 0.80
LQFP-44 44 10X10 0.80
LQFP-48 48 7X7 0.50
LQFP-52 52 10X10 0.65
LQFP-64 64 7X7 0.40
LQFP-64 64 10X10 0.50
LQFP-64 64 14X14 0.80
LQFP-100 100 14X14 0.50
LQFP-120 120 14X14 0.40
LQFP-128 128 14X14 0.40
LQFP-144 144 20X20 0.50
LQFP-176 176 24X24 0.50

IC Packaging services for Semiconix Semiconductor board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.

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