IC Packaging services for Semiconix Semiconductor board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.
REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP

   
semiconix semiconductor - where the future is today - gold chip technology SMALL OUTLINE TRANSISTOR
PACKAGE INFORMATION
   

GOLD CHIP TECHNOLOGY™
 
SOT 23 - SMALL OUTLINE TRANSISTOR PACKAGE SC70-4 - SMALL OUTLINE TRANSISTOR PACKAGE
SOT143 - SMALL OUTLINE TRANSISTOR PACKAGE SOT326, SC70-6 - SMALL OUTLINE TRANSISTOR PACKAGE
SOT223 - SMALL OUTLINE TRANSISTOR PACKAGE SC70-8 - SMALL OUTLINE TRANSISTOR PACKAGE
SOT25 - SMALL OUTLINE TRANSISTOR PACKAGE SC90 - SMALL OUTLINE TRANSISTOR PACKAGE
SOT26 - SMALL OUTLINE TRANSISTOR PACKAGE SOT89 - SMALL OUTLINE TRANSISTOR PACKAGE
SOT323, SC70-3 - SMALL OUTLINE TRANSISTOR PACKAGE SOT66 - SMALL OUTLINE TRANSISTOR PACKAGE

SMALL OUTLINE TRANSISTOR SOT package is a rectangular surface mount transistor or diode with three or more gull wings leads. The leads are on two length sides of the package. SOT package are JEDEC compliant. Popular sizes are the SOT23, SOT143, SOT223 and SOT89. SOT components are available on plastic tape and reel.
IC Packaging services for Semiconix Semiconductor board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.

HOME>Package Information>

SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com
Tel:(408)758-8692 Fax:(408)986-8027
SEMICONIX SEMICONDUCTOR
Last updated:July 03, 2009 Display settings for best viewing: Current display settings:
Page hits: 1 Screen resolution: 1124x864 Screen resolution:
Total site visits: Color quality: 16 bit Color quality: bit
© 1990-2020 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.
Valid XHTML 1.0 Transitional by http://validator.w3.org