Goldchip technology trademark of Semiconix Corporation for known good die , flip chip , bare die , wafer foundry for discrete semiconductors, , integrated circuits and integrated passive components manufactured by Semiconix Semiconductor,MATCHED PAIR TRANSISTORS LINEAR INTEGRATED SYSTEMS CROSS REFERENCE, Linear Integrated Systems,IT120-PDIP8,IT120-SOIC8,IT120-TO-71,IT120-TO-78,IT120A-PDIP8,IT120A-SOIC8,IT120A-TO-71,IT120A-TO-78,IT121-PDIP8,IT121-SOIC8,IT121-TO-71,IT121-TO-78,IT122-PDIP8,IT122-SOIC8,IT122-TO-71,IT122-TO-78,IT124-PDIP8,IT124-SOIC8,IT124-TO-71,IT124-TO-78,LS301-PDIP8,LS301-SOIC8,LS301-TO-71,LS301-TO-78,LS302-PDIP8,LS302-SOIC8,LS302-TO-71,LS302-TO-78,LS303-PDIP8,LS303-SOIC8,LS303-TO-71,LS303-TO-78,LS310-PDIP8,LS310-SOIC8,LS310-TO-71,LS310-TO-78,LS311-PDIP8,LS311-SOIC8,LS311-TO-71,LS MATCHED PAIR TRANSISTORS LINEAR INTEGRATED SYSTEMS CROSS REFERENCE, Linear Integrated Systems,IT120-PDIP8,IT120-SOIC8,IT120-TO-71,IT120-TO-78,IT120A-PDIP8,IT120A-SOIC8,IT120A-TO-71,IT120A-TO-78,IT121-PDIP8,IT121-SOIC8,IT121-TO-71,IT121-TO-78,IT122-PDIP8,IT122-SOIC8,IT122-TO-71,IT122-TO-78,IT124-PDIP8,IT124-SOIC8,IT124-TO-71,IT124-TO-78,LS301-PDIP8,LS301-SOIC8,LS301-TO-71,LS301-TO-78,LS302-PDIP8,LS302-SOIC8,LS302-TO-71,LS302-TO-78,LS303-PDIP8,LS303-SOIC8,LS303-TO-71,LS303-TO-78,LS310-PDIP8,LS310-SOIC8,LS310-TO-71,LS310-TO-78,LS311-PDIP8,LS311-SOIC8,LS311-TO-71,LS MATCHED PAIR TRANSISTORS LINEAR INTEGRATED SYSTEMS CROSS REFERENCE, Linear Integrated Systems,IT120-PDIP8,IT120-SOIC8,IT120-TO-71,IT120-TO-78,IT120A-PDIP8,IT120A-SOIC8,IT120A-TO-71,IT120A-TO-78,IT121-PDIP8,IT121-SOIC8,IT121-TO-71,IT121-TO-78,IT122-PDIP8,IT122-SOIC8,IT122-TO-71,IT122-TO-78,IT124-PDIP8,IT124-SOIC8,IT124-TO-71,IT124-TO-78,LS301-PDIP8,LS301-SOIC8,LS301-TO-71,LS301-TO-78,LS302-PDIP8,LS302-SOIC8,LS302-TO-71,LS302-TO-78,LS303-PDIP8,LS303-SOIC8,LS303-TO-71,LS303-TO-78,LS310-PDIP8,LS310-SOIC8,LS310-TO-71,LS310-TO-78,LS311-PDIP8,LS311-SOIC8,LS311-TO-71,LS Semiconix Semiconductor designs and manufactures analog devices built on semiconductor linear technology. Semiconix Semiconductor Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing (including thin film vacuum deposition services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is supplying integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.

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	MATCHED_PAIR_TRANSISTORS LINEAR INTEGRATED SYSTEMS CROSS REFERENCE

GOLD CHIP TECHNOLOGY™

Dual NPN → Dual PNP → LINEAR INTEGRATED SYSTEMS Dual NPN matched pair transistors IT120 PDIP8 SMSIT120-06 BARE DIE FLIP CHIP nDFN PDIP8 LS310 TO-78 SMSLS310-01 BARE DIE FLIP CHIP nDFN TO-78 IT120 SOIC8 SMSIT120-07 BARE DIE FLIP CHIP nDFN SOIC8 LS311 PDIP8 SMSLS311-02 BARE DIE FLIP CHIP nDFN PDIP8 IT120 TO-71 SMSIT120-04 BARE DIE FLIP CHIP nDFN TO-71 LS311 SOIC8 SMSLS311-03 BARE DIE FLIP CHIP nDFN SOIC8 IT120 TO-78 SMSIT120-05 BARE DIE FLIP CHIP nDFN TO-78 LS311 TO-71 SMSLS311 BARE DIE FLIP CHIP nDFN TO-71 IT120A PDIP8 SMSIT120A-02 BARE DIE FLIP CHIP nDFN PDIP8 LS311 TO-78 SMSLS311-01 BARE DIE FLIP CHIP nDFN TO-78 IT120A SOIC8 SMSIT120A-03 BARE DIE FLIP CHIP nDFN SOIC8 LS312 PDIP8 SMSLS312-02 BARE DIE FLIP CHIP nDFN PDIP8 IT120A TO-71 SMSIT120A BARE DIE FLIP CHIP nDFN TO-71 LS312 SOIC8 SMSLS312-03 BARE DIE FLIP CHIP nDFN SOIC8 IT120A TO-78 SMSIT120A-01 BARE DIE FLIP CHIP nDFN TO-78 LS312 TO-71 SMSLS312 BARE DIE FLIP CHIP nDFN TO-71 IT121 PDIP8 SMSIT121-02 BARE DIE FLIP CHIP nDFN PDIP8 LS312 TO-78 SMSLS312-01 BARE DIE FLIP CHIP nDFN TO-78 IT121 SOIC8 SMSIT121-03 BARE DIE FLIP CHIP nDFN SOIC8 LS313 PDIP8 SMSLS313-02 BARE DIE FLIP CHIP nDFN PDIP8 IT121 TO-71 SMSIT121 BARE DIE FLIP CHIP nDFN TO-71 LS313 SOIC8 SMSLS313-03 BARE DIE FLIP CHIP nDFN SOIC8 IT121 TO-78 SMSIT121-01 BARE DIE FLIP CHIP nDFN TO-78 LS313 TO-71 SMSLS313 BARE DIE FLIP CHIP nDFN TO-71 IT122 PDIP8 SMSIT122-02 BARE DIE FLIP CHIP nDFN PDIP8 LS313 TO-78 SMSLS313-01 BARE DIE FLIP CHIP nDFN TO-78 IT122 SOIC8 SMSIT122-03 BARE DIE FLIP CHIP nDFN SOIC8 LS318 PDIP8 SMSLS318-02 BARE DIE FLIP CHIP nDFN PDIP8 IT122 TO-71 SMSIT122 BARE DIE FLIP CHIP nDFN TO-71 LS318 SOIC8 SMSLS318-03 BARE DIE FLIP CHIP nDFN SOIC8 IT122 TO-78 SMSIT122-01 BARE DIE FLIP CHIP nDFN TO-78 LS318 TO-71 SMSLS318 BARE DIE FLIP CHIP nDFN TO-71 IT124 PDIP8 SMSIT124-02 BARE DIE FLIP CHIP nDFN PDIP8 LS318 TO-78 SMSLS318-01 BARE DIE FLIP CHIP nDFN TO-78 IT124 SOIC8 SMSIT124-03 BARE DIE FLIP CHIP nDFN SOIC8 LS3250A PDIP8 SMSLS3250A-03 BARE DIE FLIP CHIP nDFN PDIP8 IT124 TO-71 SMSIT124 BARE DIE FLIP CHIP nDFN TO-71 LS3250A SOIC8 SMSLS3250A-04 BARE DIE FLIP CHIP nDFN SOIC8 IT124 TO-78 SMSIT124-01 BARE DIE FLIP CHIP nDFN TO-78 LS3250A SOT-23 SMSLS3250A BARE DIE FLIP CHIP nDFN SOT-23 LS301 PDIP8 SMSLS301-02 BARE DIE FLIP CHIP nDFN PDIP8 LS3250A TO-71 SMSLS3250A-01 BARE DIE FLIP CHIP nDFN TO-71 LS301 SOIC8 SMSLS301-03 BARE DIE FLIP CHIP nDFN SOIC8 LS3250A TO-78 SMSLS3250A-02 BARE DIE FLIP CHIP nDFN TO-78 LS301 TO-71 SMSLS301 BARE DIE FLIP CHIP nDFN TO-71 LS3250B PDIP8 SMSLS3250B-03 BARE DIE FLIP CHIP nDFN PDIP8 LS301 TO-78 SMSLS301-01 BARE DIE FLIP CHIP nDFN TO-78 LS3250B SOIC8 SMSLS3250B-04 BARE DIE FLIP CHIP nDFN SOIC8 LS302 PDIP8 SMSLS302-02 BARE DIE FLIP CHIP nDFN PDIP8 LS3250B SOT-23 SMSLS3250B BARE DIE FLIP CHIP nDFN SOT-23 LS302 SOIC8 SMSLS302-03 BARE DIE FLIP CHIP nDFN SOIC8 LS3250B TO-71 SMSLS3250B-01 BARE DIE FLIP CHIP nDFN TO-71 LS302 TO-71 SMSLS302 BARE DIE FLIP CHIP nDFN TO-71 LS3250B TO-78 SMSLS3250B-02 BARE DIE FLIP CHIP nDFN TO-78 LS302 TO-78 SMSLS302-01 BARE DIE FLIP CHIP nDFN TO-78 LS3250C PDIP8 SMSLS3250C-03 BARE DIE FLIP CHIP nDFN PDIP8 LS303 PDIP8 SMSLS303-02 BARE DIE FLIP CHIP nDFN PDIP8 LS3250C SOIC8 SMSLS3250C-04 BARE DIE FLIP CHIP nDFN SOIC8 LS303 SOIC8 SMSLS303-03 BARE DIE FLIP CHIP nDFN SOIC8 LS3250C SOT-23 SMSLS3250C BARE DIE FLIP CHIP nDFN SOT-23 LS303 TO-71 SMSLS303 BARE DIE FLIP CHIP nDFN TO-71 LS3250C TO-71 SMSLS3250C-01 BARE DIE FLIP CHIP nDFN TO-71 LS303 TO-78 SMSLS303-01 BARE DIE FLIP CHIP nDFN TO-78 LS3250C TO-78 SMSLS3250C-02 BARE DIE FLIP CHIP nDFN TO-78 LS310 PDIP8 SMSLS310-02 BARE DIE FLIP CHIP nDFN PDIP8 LS310 SOIC8 SMSLS310-03 BARE DIE FLIP CHIP nDFN SOIC8 LS310 TO-71 SMSLS310 BARE DIE FLIP CHIP nDFN TO-71 LINEAR INTEGRATED SYSTEMS Dual PNP matched pair transistors IT130 PDIP8 SMSIT130-06 BARE DIE FLIP CHIP nDFN PDIP8 LS351 TO-78 SMSLS351-01 BARE DIE FLIP CHIP nDFN TO-78 IT130 SOIC8 SMSIT130-07 BARE DIE FLIP CHIP nDFN SOIC8 LS352 PDIP8 SMSLS352-02 BARE DIE FLIP CHIP nDFN PDIP8 IT130 TO-71 SMSIT130-04 BARE DIE FLIP CHIP nDFN TO-71 LS352 SOIC8 SMSLS352-03 BARE DIE FLIP CHIP nDFN SOIC8 IT130 TO-78 SMSIT130-05 BARE DIE FLIP CHIP nDFN TO-78 LS352 TO-71 SMSLS352 BARE DIE FLIP CHIP nDFN TO-71 IT130A PDIP8 SMSIT130A-02 BARE DIE FLIP CHIP nDFN PDIP8 LS352 TO-78 SMSLS352-01 BARE DIE FLIP CHIP nDFN TO-78 IT130A SOIC8 SMSIT130A-03 BARE DIE FLIP CHIP nDFN SOIC8 LS3550A PDIP8 SMSLS3550A-02 BARE DIE FLIP CHIP nDFN PDIP8 IT130A TO-71 SMSIT130A BARE DIE FLIP CHIP nDFN TO-71 LS3550A SOIC8 SMSLS3550A-03 BARE DIE FLIP CHIP nDFN SOIC8 IT130A TO-78 SMSIT130A-01 BARE DIE FLIP CHIP nDFN TO-78 LS3550A TO-71 SMSLS3550A BARE DIE FLIP CHIP nDFN TO-71 IT131 PDIP8 SMSIT131-02 BARE DIE FLIP CHIP nDFN PDIP8 LS3550A TO-78 SMSLS3550A-01 BARE DIE FLIP CHIP nDFN TO-78 IT131 SOIC8 SMSIT131-03 BARE DIE FLIP CHIP nDFN SOIC8 LS3550B PDIP8 SMSLS3550B-02 BARE DIE FLIP CHIP nDFN PDIP8 IT131 TO-71 SMSIT131 BARE DIE FLIP CHIP nDFN TO-71 LS3550B SOIC8 SMSLS3550B-03 BARE DIE FLIP CHIP nDFN SOIC8 IT131 TO-78 SMSIT131-01 BARE DIE FLIP CHIP nDFN TO-78 LS3550B TO-71 SMSLS3550B BARE DIE FLIP CHIP nDFN TO-71 IT132 PDIP8 SMSIT132-02 BARE DIE FLIP CHIP nDFN PDIP8 LS3550B TO-78 SMSLS3550B-01 BARE DIE FLIP CHIP nDFN TO-78 IT132 SOIC8 SMSIT132-03 BARE DIE FLIP CHIP nDFN SOIC8 LS3550C PDIP8 SMSLS3550C-02 BARE DIE FLIP CHIP nDFN PDIP8 IT132 TO-71 SMSIT132 BARE DIE FLIP CHIP nDFN TO-71 LS3550C SOIC8 SMSLS3550C-03 BARE DIE FLIP CHIP nDFN SOIC8 IT132 TO-78 SMSIT132-01 BARE DIE FLIP CHIP nDFN TO-78 LS3550C TO-71 SMSLS3550C BARE DIE FLIP CHIP nDFN TO-71 LS350 PDIP8 SMSLS350-02 BARE DIE FLIP CHIP nDFN PDIP8 LS3550C TO-78 SMSLS3550C-01 BARE DIE FLIP CHIP nDFN TO-78 LS350 SOIC8 SMSLS350-03 BARE DIE FLIP CHIP nDFN SOIC8 LS358 PDIP8 SMSLS358-02 BARE DIE FLIP CHIP nDFN PDIP8 LS350 TO-71 SMSLS350 BARE DIE FLIP CHIP nDFN TO-71 LS358 SOIC8 SMSLS358-03 BARE DIE FLIP CHIP nDFN SOIC8 LS350 TO-78 SMSLS350-01 BARE DIE FLIP CHIP nDFN TO-78 LS358 TO-71 SMSLS358 BARE DIE FLIP CHIP nDFN TO-71 LS351 PDIP8 SMSLS351-02 BARE DIE FLIP CHIP nDFN PDIP8 LS358 TO-78 SMSLS358-01 BARE DIE FLIP CHIP nDFN TO-78 LS351 SOIC8 SMSLS351-03 BARE DIE FLIP CHIP nDFN SOIC8 LS351 TO-71 SMSLS351 BARE DIE FLIP CHIP nDFN TO-71

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