MLP (Micro Leadframe Package) is a JEDEC compliant QFN plastic package. This near CSP package is available in Micro (MLPM), Quad (MLPQ), and Dual (MLPD). The Dual technology allows the ability to provide foot print compatible replacements for SOIC, SSOP, TSSOP, and MSOP packages based on customer needs. The MLPs have an exposed die attach pad that provides an effective thermal path when soldered to a Printed Circuit Board (PCB), therefore providing a cost effective thermal enhancement as well as improved electrical performance. This small thin package is an ideal choice for applications where weight, size and high performance are required. Devices are typically used in applications for mobile phones, PDAs, GPS, and RF products.
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  MLP Micro Fused Exposed Pad

PACKAGE OUTLINE
MICRO LEADFRAME PACKAGE

SHORT PACKAGE DESCRIPTION
MLP (Micro Leadframe Package) is a JEDEC compliant QFN plastic package. This near CSP package is available in Micro (MLPM), Quad (MLPQ), and Dual (MLPD). The Dual technology allows the ability to provide foot print compatible replacements for SOIC, SSOP, TSSOP, and MSOP packages based on customer needs. The MLPs have an exposed die attach pad that provides an effective thermal path when soldered to a Printed Circuit Board (PCB), therefore providing a cost effective thermal enhancement as well as improved electrical performance. This small thin package is an ideal choice for applications where weight, size and high performance are required. Devices are typically used in applications for mobile phones, PDAs, GPS, and RF products.


Delivery for packaged standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconix guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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