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SMX LM324 Low Power Quad Operational Amplifiers same as Texas Instruments LM324, BayLinear LM324, Fairchild Semiconductor LM324A, Fairchild Semiconductor LM324N, Fairchild Semiconductor LM324AMX, Fairchild Semiconductor LM324AN, Fairchild Semiconductor LM324MX, Fairchild Semiconductor LM324AM, Fairchild Semiconductor LM324M, Fairchild Semiconductor LM324, Intersil LM324, Intersil LM324N, Motorola LM324AD, Motorola LM324, Motorola LM324AN, Motorola LM324A, Motorola LM324N, Motorola LM324D, National Semiconductor LM324N, National Semiconductor LM324AMX, National Semiconductor LM324AN, National Semiconductor LM324AM, National Semiconductor LM324MX, National Semiconductor LM324M, National Semiconductor LM324 MDA, National Semiconductor LM324 MWA, National Semiconductor LM324J, National Semiconductor LM324, National Semiconductor LM324MT, National Semiconductor LM324MTX, ON Semiconductor LM324DT, ON Semiconductor LM324AN, ON Semiconductor LM324DTBR2, ON Semiconductor LM324DTB, ON Semiconductor LM324DR2, ON Semiconductor LM324-D, ON Semiconductor LM324ADTBR2, ON Semiconductor LM324ADTB, ON Semiconductor LM324AD, ON Semiconductor LM324A, ON Semiconductor LM324, ON Semiconductor LM324N, ON Semiconductor LM324ADR2, ON Semiconductor LM324D, Philips LM324D, Philips LM324F, Philips LM324, Philips LM324A, Philips LM324AD, Philips LM324N, Philips LM324AN, SGS Thomson Microelectronics LM324, SGS Thomson Microelectronics LM324ADT, SGS Thomson Microelectronics LM324DT, SGS Thomson Microelectronics LM324AD, SGS Thomson Microelectronics LM324A, SGS Thomson Microelectronics LM324D, ST Microelectronics LM324DT, ST Microelectronics LM324N, ST Microelectronics LM324W, ST Microelectronics LM324WN, ST Microelectronics LM324WDT, ST Microelectronics LM324WD, ST Microelectronics LM324PT, ST Microelectronics LM324WPT, ST Microelectronics LM324AN, ST Microelectronics LM324ADT, ST Microelectronics LM324AP, ST Microelectronics LM324APT, ST Microelectronics LM324AD, ST Microelectronics LM324, ST Microelectronics LM324A, ST Microelectronics LM224A-LM324A, ST Microelectronics LM324D, ST Microelectronics LM324P, ST Microelectronics LM224-LM324, Texas Instruments LM324YDB, Texas Instruments LM324ADR, Texas Instruments LM324YN, Texas Instruments LM324ADBR, Texas Instruments LM324ADBLE, Texas Instruments LM324ADB, Texas Instruments LM324AD, Texas Instruments LM324PW, Texas Instruments LM324N, Texas Instruments LM324, Texas Instruments LM324Y, Texas Instruments LM324PWR, Texas Instruments LM324PWLE, Texas Instruments LM324YD, Texas Instruments LM324A, Texas Instruments LM324D, Texas Instruments LM324NSR, Texas Instruments LM324YPW, Texas Instruments LM324AN, Texas Instruments LM324KAN, Texas Instruments LM324KADR, Texas Instruments LM324KAD, Texas Instruments LM324KA, Texas Instruments LM324K, Texas Instruments LM324APW, Texas Instruments LM324APWLE, Texas Instruments LM324APWR, Texas Instruments LM324DB, Texas Instruments LM324DBLE, Texas Instruments LM324KANS, Texas Instruments LM324KANSR, Texas Instruments LM324KAPW, Texas Instruments LM324ANSR, Texas Instruments LM324AP, Texas Instruments LM324KPWR, Texas Instruments LM324KPW, Texas Instruments LM324KNSR, Texas Instruments LM324KNS, Texas Instruments LM324KN, Texas Instruments LM324KDR, Texas Instruments LM324KD, Texas Instruments LM324KAPWR, Texas Instruments LM324DR manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire.
BayLinear LM324, Fairchild Semiconductor LM324, Intersil LM324, Motorola LM324, National Semiconductor LM324, ON Semiconductor LM324, Philips LM324, SGS Thomson Microelectronics LM324, ST Microelectronics LM224A-LM324A, Texas Instruments LM324
SMX LM324 Low Power Quad Operational Amplifiers same as Texas Instruments LM324, BayLinear LM324, Fairchild Semiconductor LM324A,
Fairchild Semiconductor LM324N, Fairchild Semiconductor LM324AMX, Fairchild Semiconductor LM324AN, Fairchild Semiconductor LM324MX,
Fairchild Semiconductor LM324AM, Fairchild Semiconductor LM324M, Fairchild Semiconductor LM324, Intersil LM324, Intersil LM324N, Motorola
LM324AD, Motorola LM324, Motorola LM324AN, Motorola LM324A, Motorola LM324N, Motorola LM324D, National Semiconductor LM324N, National
Semiconductor LM324AMX, National Semiconductor LM324AN, National Semiconductor LM324AM, National Semiconductor LM324MX, National
Semiconductor LM324M, National Semiconductor LM324 MDA, National Semiconductor LM324 MWA, National Semiconductor LM324J, National
Semiconductor LM324, National Semiconductor LM324MT, National Semiconductor LM324MTX, ON Semiconductor LM324DT, ON Semiconductor LM324AN,
ON Semiconductor LM324DTBR2, ON Semiconductor LM324DTB, ON Semiconductor LM324DR2, ON Semiconductor LM324-D, ON Semiconductor LM324ADTBR2,
ON Semiconductor LM324ADTB, ON Semiconductor LM324AD, ON Semiconductor LM324A, ON Semiconductor LM324, ON Semiconductor LM324N, ON
Semiconductor LM324ADR2, ON Semiconductor LM324D, Philips LM324D, Philips LM324F, Philips LM324, Philips LM324A, Philips LM324AD, Philips
LM324N, Philips LM324AN, SGS Thomson Microelectronics LM324, SGS Thomson Microelectronics LM324ADT, SGS Thomson Microelectronics LM324DT,
SGS Thomson Microelectronics LM324AD, SGS Thomson Microelectronics LM324A, SGS Thomson Microelectronics LM324D, ST Microelectronics
LM324DT, ST Microelectronics LM324N, ST Microelectronics LM324W, ST Microelectronics LM324WN, ST Microelectronics LM324WDT, ST
Microelectronics LM324WD, ST Microelectronics LM324PT, ST Microelectronics LM324WPT, ST Microelectronics LM324AN, ST Microelectronics
LM324ADT, ST Microelectronics LM324AP, ST Microelectronics LM324APT, ST Microelectronics LM324AD, ST Microelectronics LM324, ST
Microelectronics LM324A, ST Microelectronics LM224A-LM324A, ST Microelectronics LM324D, ST Microelectronics LM324P, ST Microelectronics
LM224-LM324, Texas Instruments LM324YDB, Texas Instruments LM324ADR, Texas Instruments LM324YN, Texas Instruments LM324ADBR, Texas
Instruments LM324ADBLE, Texas Instruments LM324ADB, Texas Instruments LM324AD, Texas Instruments LM324PW, Texas Instruments LM324N, Texas
Instruments LM324, Texas Instruments LM324Y, Texas Instruments LM324PWR, Texas Instruments LM324PWLE, Texas Instruments LM324YD, Texas
Instruments LM324A, Texas Instruments LM324D, Texas Instruments LM324NSR, Texas Instruments LM324YPW, Texas Instruments LM324AN, Texas
Instruments LM324KAN, Texas Instruments LM324KADR, Texas Instruments LM324KAD, Texas Instruments LM324KA, Texas Instruments LM324K, Texas
Instruments LM324APW, Texas Instruments LM324APWLE, Texas Instruments LM324APWR, Texas Instruments LM324DB, Texas Instruments LM324DBLE,
Texas Instruments LM324KANS, Texas Instruments LM324KANSR, Texas Instruments LM324KAPW, Texas Instruments LM324ANSR, Texas Instruments
LM324AP, Texas Instruments LM324KPWR, Texas Instruments LM324KPW, Texas Instruments LM324KNSR, Texas Instruments LM324KNS, Texas
Instruments LM324KN, Texas Instruments LM324KDR, Texas Instruments LM324KD, Texas Instruments LM324KAPWR, Texas Instruments LM324DR
manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete
semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of
Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and
integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or
copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on
board, assembled via flip chip or chip and wire. BayLinear LM324, Fairchild Semiconductor LM324, Intersil LM324, Motorola LM324, National
Semiconductor LM324, ON Semiconductor LM324, Philips LM324, SGS Thomson Microelectronics LM324, ST Microelectronics LM224A-LM324A, Texas
Instruments LM324 REGISTER-LOGIN PRODUCTS CROSS REFERENCE /cgi-bin/stock.pl?part=LM324">INVENTORY
/cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXLM324&c_item_1=">REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE
MAP semiconix semiconductor - where the future is today - gold chip technology SMX LM324 - BARE DIE GOLD CHIP TECHNOLOGY™ Low Power Quad
Operational Amplifiers FEATURES APPLICATIONS Quad Operational Amplifiers Internally frequency compensated for unity gain Large DC voltage
gain 100dB Wide bandwidth (unitygain) 1MHz Very low supply current drain (700µA) - essentially independent of supply voltage Low input
biasing current 45 nA Low input offset voltage 2mV and offset current 5nA In DIE form, this device is an excellent selection for many chip
and wire HYBRID CIRCUITS LM324 LM324 Low Power Quad Operational Amplifiers SMXLM324 Low Power Quad Operational Amplifiers - PRODUCT
DESCRIPTION The SMX LM324 series are low cost, quad operational amplifiers with true differential inputs. They have several distinct
advantages over standard operational amplifier types in single supply applications. The quad amplifier can operate at supply voltages as
low as 3.0 V or as high as 32 V with quiescent currents about one fifth of those associated with the MC1741 (on a per amplifier basis). The
common mode input range includes the negative supply, thereby eliminating the necessity for external biasing components in many
applications. The output voltage range also includes the negative power supply voltage. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE -
SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed
technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and
SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive
assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a
package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades.
Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive
to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die
for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also
offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical,
military and space applications. See AN-SMX-001 SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS Semiconductor Integrated Circuits
are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ
precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect
metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily
integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions. SCHEMATIC DIAGRAM LM324
Texas Instruments LM324 Low Power Quad Operational Amplifiers LM324 MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Power Supply Voltage Vdc
Single Supply VCC 32 V Split Supplies VCC,VEE ±16 V Input Differential Voltage Range (Note 1) VDIR ±32 V Input Common Mode Voltage Range
VICR -0.3 to 32 V Output Short Circuit Duration tSC Continuous Junction Temperature TJ 150 °C Storage Temperature Range Tstg -55 to +125 °C
Operating Ambient Temperature Range TA 0 to +70 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond
listed absolute maximum ratings may cause permanent damage to the device. LM324 ELECTRICAL CHARACTERISTICS TA=25°C unless otherwise
specificed PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS Input Offset Voltage VCC=5.0V to 30V VICR=0V to VCC=1.7V VO=1.4V, RS=0W
TA=250°C TA=Thigh(Note 1) TA=Tlow(Note 1) VIO - - - 2.0 - - 7.0 9.0 9.0 mV Average Temperature Coefficient of Input Offset Voltage TA=Thigh
to Tlow(Note 1) ΔVIO/ΔT - 7 - µV/°C Input Offset Current Input Bias Current TA=Thigh to Tlow (Note 1) TA=Thigh to Tlow (Note 1) IIO - - - -
5.0 - -90 - 50 150 -250 -500 nA Average Temperature Coefficient of Input Offset Voltage TA=Thigh to Tlow (Note 1) - 10 - pA/°C Input Common
Mode Voltage Range (Note 2) VCC=30V V=30V TA=Thigh to Tlow (Note 1) VICR 0 0 - - 28.3 28 V Differential Input Voltage Range VIDR - - VCC V
Large Signal Open Loop Voltage Gain RL=2.0kW, VCC=15V, for Large VOSwing, TA=Thigh to Tlow (Note 1) AVOL 25 15 100 - - - V/mV Channel
Separation 1.0kHz≤ f≤20kHz Input Referenced CS - -120 - dB Common Mode Rejection RS≤ 10kW CMR 65 70 - dB Power Supply Rejection PSR 65 100
- dB Output Voltage-High Limit (TA=Thigh to Tlow) (Note 1) VCC=5.0V, RL=2.0kW, TA=25°C VCC=30V, RL=2.0kW VCC=30V, RL=10kW VOH 3.3 26 27 3.5
- 28 - - - V Output Voltage-Low Limit VCC=5.0V, RL=10kW (TA=Thigh to Tlow) (Note 1) VOL - 5 20 mV Output Source Current VID=+1.0V, VCC=15V
TA=25°C TA=Thigh to Tlow IO+ 20 10 40 20 - - mA Output Sink Current VID=-1.0V, VCC=15V TA=25°C TA=Thigh to Tlow VID=-1.0V, VCC=200mV IO- 10
5.0 12 20 8.0 50 - - mA µA Output Short Circuit to Ground (Note 3) ISC - 40 60 mA Power Supply Current TA=Thigh to Tlow (Note 1) VCC=30V,
VO=0V, RL=¥ VCC=5.0V, VO=0V, RL=¥ ICC - - - - 3.0 1.2 mA Note1 Tlow=0°C for LM324, Thigh=+70°C for LM324 Note2 The input common mode
voltage or either input signal voltage should not be allowed to go negative by more than 0.3V. The upper end of the common mode voltage
range is VCC -1.7V. pan> SPICE MODEL CROSS REFERENCE PARTS GENERAL DIE INFORMATION Substrate Thickness [mils] Die size mils [mm] Bonding
pads Backside metallization Silicon 10 62.992 x 59.843 ±1 [1.6 x 1.52] 3.543 x 3.543 mils, 1µm thick, aluminium Backside of the die is
coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. LM324 DIE LAYOUT - MECHANICAL SPECIFICATIONS LM324 DIE
LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) 1 #1 OUT 34.96 0.888 3.464 2 #1 IN- 56.102 1.425 7.283 3 #1 IN+
56.102 1.425 20.511 4 VCC 56.102 1.425 28.031 5 #2 IN+ 56.102 1.425 35.787 6 #2 IN- 56.102 1.425 49.015 7 #2 OUT 34.96 0.888 52.834 8 #3
OUT 28.488 0.622 1.342 9 #3 IN- 3.346 0.085 1.245 10 #3 IN+ 3.346 0.085 0.909 11 GND 3.72 0.094 0.712 12 #4 IN+ 3.346 0.085 0.521 13 #4 IN-
3.346 0.085 0.185 14 #4 OUT 24.488 0.622 0.088 SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix standard bare die
components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or
Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au,
Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die
attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be
used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire!
In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in
some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are
brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000. LM324 STANDARD PRODUCTS
PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USMLM324 100pc -WP 3.2 Products sold for space, military or medical
applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case
basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales
department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every
effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any
infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its
product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are
intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility
applications without the specific written consent. HOME PRODUCT TREE PACKAGES /cgi-bin/getpdf.pl?part=SMXLM324&idx=30">PDF VERSION SEARCH
SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last
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