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SMXCZRM27C12P Zener Diode, 12.05V 5%,800mW same as Comchip CZRM27C12P manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor
SMXCZRM27C12P Zener Diode, 12.05V 5%,800mW same as Comchip CZRM27C12P manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor /images/watermark.gif);background-position: center center;background-repeat: repeat-y;"> REGISTER-LOGIN PRODUCTS CROSS REFERENCE /cgi-bin/stock.pl?part=SMXCZRM27C12P">INVENTORY /cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXCZRM27C12P&c_item_1=Zener%20Diode,%2012.05V%20%205%,800mW">REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMXCZRM27C12P - nanoDFN GOLD CHIP TECHNOLOGYâ„¢ Zener Diode, 12.05V 5%,800mW FEATURES APPLICATIONS ZENER DIODE High reliability nanoDFN package Unique 10mils thin design Gold over nickel metallization RoHS compliant, Lead Free Compatible with surface mount, chip and wire and flip chip assembly process. Chip on Board System in package SIP Hybrid Circuits Automotive, Biotechnology, Computers, Military, Medical, MEMS, Optoelectronics, Space, Telecommunications Smart Cards, RFID, PDA, Laptops, Mobile phones SMXCZRM27C12P CZRM27C12P Zener Diode, 12.05V 5%,800mW ZENER DIODES - PRODUCT DESCRIPTION Zener diodes are p-n junction diodes. From the point of view of breakdown mechanism, true Zener diodes are only diodes with reverse breakdown voltage less than approximately 5.6V. Diodes with breakdown voltage >5.6V are in fact avalanche diodes. Zener diodes are used in simple shunt voltage regulators circuits, reference voltage, and for ESD protection. Semiconix Zener diode series are available in very thin nanoDFN package. These products are ideal for surface mount, hybrid circuits and multi chip module applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25°C unless otherwise specified PD Power Dissipation 800 mW Tstg Storage Temperature Range -65 °C Tj Maximum Junction Temperature 150 °C ELECTRICAL CHARACTERISTICS @ 25°C unless otherwise specified Symbol Parameter Value Unit Min. Typ. Max VZT Zener Voltage @ IZT= 50.00 [mA] 11.4 12.05 12.7 V ZZT Impedance @ IZT = 50.00 [mA] 7 W IR Current leakage @ VR = 9.10 [V] 3 µA dVz dVz/dT 0.05 0.1 mV/K SPICE MODEL CROSS REFERENCE PARTS: GENERAL DIE INFORMATION Substrate Thickness [mils] Package size Pads dimensions per drawing Backside Silicon 10±2 1.52x0.76mm [60x30mils] Gold Tin, Ni/Au, 5µm±1 thickness, solder reflow assembly Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS SMXCZRM27C12P Comchip CZRM27C12P Zener Diode, 12.05V 5%,800mW nanoDFN SMXCZRM27C12P Comchip CZRM27C12P Zener Diode, 12.05V 5%,800mW nanoDFN SMXCZRM27C12P Comchip CZRM27C12P Zener Diode, 12.05V 5%,800mW SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE SMX-nDFN - NanoDFN package is a very thin (10mils) proprietary wafer level chip size package W-CSP technology developed by Semiconix. SMX-nDFN is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at >220°C, clean, etc. SMX-nDFN packages can also be attached with conductive silver epoxy in low temperature applications. The assembly process is also very simple and inexpensive consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. SMX-nDFN packages are available in many sizes with landing pads compatible with the industry standard CSP as well as many surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) TAPE & REEL MIN QUANTITY U/P($) nDFN SMXCZRM27C12P-nDFN -WP 10000 - -TR 9000 - nDFN SMXCZRM27C12P-nDFN -WP 50000 - -TR 45000 - PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES /cgi-bin/getpdf.pl?part=SMXCZRM27C12P&idx=2934">PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated: Display settings for best viewing: Current display settings: Page hits: Screen resolution: 1124x864 Screen resolution: Total site visits: Color quality: 16 bit Color quality: bit © 1990- SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.
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