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SMSBB179-03 Single Varactor (Tuning) Diode 19pF same as LRC BB179B, LRC BB179B, NXP_Philips BB179B, NXP_Philips BB179B LRC BB179B manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor
SMSBB179-03 Single Varactor (Tuning) Diode 19pF same as LRC BB179B, LRC BB179B, NXP_Philips BB179B, NXP_Philips BB179B LRC BB179B - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire.
SMSBB179-03 Single Varactor (Tuning) Diode 19pF same as LRC BB179B, LRC BB179B, NXP_Philips BB179B,
NXP_Philips BB179B LRC BB179B manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip
chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from
Semiconix Semiconductor SMSBB179-03 Single Varactor (Tuning) Diode 19pF same as LRC BB179B, LRC BB179B, NXP_Philips
BB179B, NXP_Philips BB179B LRC BB179B - Goldchip technology is trademark of Semiconix Corporation for known good die,
flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components
manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for
high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or
chip on board, assembled via flip chip or chip and wire. /images/watermark.gif);background-position: center
center;background-repeat: repeat-y;"> REGISTER-LOGIN PRODUCTS CROSS REFERENCE
/cgi-bin/stock.pl?part=SMSBB179-03">INVENTORY
/cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMSBB179-03&c_item_1=Single%20Varactor%20(Tuning)%20Diode%2019pF"
;>REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix
semiconductor - where the future is today - gold chip technology SMSBB179-03 - nanoDFN GOLD CHIP TECHNOLOGYâ„¢ Single
Varactor (Tuning) Diode 19pF FEATURES APPLICATIONS VARACTOR DIODE High reliability nanoDFN package Unique 10mils thin
design Gold over nickel metallization RoHS compliant, Lead Free Compatible with surface mount, chip and wire and flip
chip assembly process. Chip on Board System in package SIP Hybrid Circuits Parametric amplifiers, Parametric
Oscillators Voltage-controlled oscillators PLL (phase-locked loops) Frequency synthesizers. SMSBB179-03 BB179B Single
Varactor (Tuning) Diode 19pF VARACTOR DIODES - PRODUCT DESCRIPTION Varicap Diode, Varactor Diode, Variable Capacitance
Diode or Tuning Diode is a type of diode which has a variable capacitance that is a function of the voltage impressed
on its terminals. Varactors are operated reverse-biased so no current flows, but since the thickness of the depletion
zone varies with the applied bias voltage, the capacitance of the diode can be made to vary. Generally, the depletion
region thickness is proportional to the square root of the applied voltage; and capacitance is inversely proportional
to the depletion region thickness. Thus, the capacitance is inversely proportional to the square root of applied
voltage. All diodes exhibit this phenomenon to some degree, but specially made varactor diodes exploit the effect to
boost the capacitance and variability range achieved - most diode fabrication attempts to achieve the opposite.
Varactors are principally used as a voltage-controlled capacitor, rather than as rectifiers. They are commonly used in
parametric amplifiers, parametric oscillators and voltage-controlled oscillators as part of phase-locked loops and
frequency synthesizers. Semiconix Varactor diodes series are available in very thin 0201 nanoDFN package. These
products are ideal for surface mount, hybrid circuits and multi chip module applications. HIGH RELIABILITY BARE DIE AND
SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven
mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be
easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter
design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme
applications the bare die has to withstand also harsh environmental conditions without the protection of a package.
KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and
degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum
pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered
industry standard products and now offers known good die for bare die applications with gold interconnection and
well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board
technology with integrated passive components as a complete high reliability SIP solution for medical, military and
space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are
manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices
employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and
gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome
SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom
complex discrete device solutions. Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value
Unit Diode reverse voltage VR 32 V Forward current IF 20 mA Operating temperature range Top -55 ... 150 °C Storage
temperature Tstg -55 ... 125 °C Electrical Characteristics at TA= 25°C, unless otherwise specified Name Symbol Test
Conditions Value Unit Min. Typ. Max Reverse current IR1 VR=30V 10 nA Reverse current IR2 VR=30V;Tj=85grdC 200 nA Diode
capacitance CT1 VR=1V,f=1MHz 18.22 20 pF Diode capacitance CT2 VR=28V,f=1MHz 1.9 2.1 2.25 pF Capacitance ratio CT1/CT2
VR=1 V, VR=2 V, f=1 MHz 1.27 Capacitance ratio CT1/CT28 VR=1 V, VR=28 V, f=1 MHz 8.45 9 10 Capacitance ratio CT25/CT28
VR=25 V, VR=28 V, f=1 MHz 1.05 Capacitance matching1) DCT/CT VR=1 V to28V; in a sequence of 10diodes 2 % Series
resistance rS f=470MHz; Cd=9pF 0.6 0.75 ohm SPICE MODEL CROSS REFERENCE PARTS: GENERAL DIE INFORMATION Substrate
Thickness [mils] Package size Pads dimensions per drawing Backside Silicon 10±2 1.02x0.51mm [40x20mils] Gold Tin,
Ni/Au, 5µm±1 thickness, solder reflow assembly Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD
LOCATIONS SMSBB179-03 LRC BB179B, LRC BB179B, NXP_Philips BB179B, NXP_Philips BB179B LRC BB179B Single Varactor
(Tuning) Diode 19pF nanoDFN SMSBB179-03 LRC BB179B, LRC BB179B, NXP_Philips BB179B, NXP_Philips BB179B LRC BB179B
Single Varactor (Tuning) Diode 19pF nanoDFN SMSBB179-03 LRC BB179B, LRC BB179B, NXP_Philips BB179B, NXP_Philips BB179B
LRC BB179B Single Varactor (Tuning) Diode 19pF SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE SMX-nDFN -
NanoDFN package is a very thin (10mils) proprietary wafer level chip size package W-CSP technology developed by
Semiconix. SMX-nDFN is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip
chip applications. The assembly process is same as for packaged surface mount components. The process consist of at
least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky
solder paste; -dry paste, reflow at >220°C, clean, etc. SMX-nDFN packages can also be attached with conductive
silver epoxy in low temperature applications. The assembly process is also very simple and inexpensive consisting of 3
steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver
epoxy and inspect. SMX-nDFN packages are available in many sizes with landing pads compatible with the industry
standard CSP as well as many surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE
PACKS QUANTITY U/P($) TAPE & REEL MIN QUANTITY U/P($) nDFN SMSBB179-03-nDFN -WP 10000 -TR 45000 nDFN
SMSBB179-03-nDFN -WP 50000 -TR 225000 SC79 SMSBB179-03-SC79 -WP 1000 -TR 225000 PRICES - Listed prices are only for
standard products, available from stock. Inventory is periodically updated. List prices for other quantities and
tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum
line item order of $550.00. No rights can be derived from pricing information provided on this website. Such
information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and
without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult
factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and
availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom
products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100%
functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place
applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or
custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have
issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only
orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix
sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional
tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice
are also shipped on film frame -FF. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT
QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate
as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of
third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product
line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems,
which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment,
submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES
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