Current regulating diode, current limiting diode, constant current diode: SMSSST503 Current Regulating Diodes same as Linear Integrated Systems SST503 Linear Integrated Systems SST503 manufactured by Semiconix Semiconductor - Gold chip technology for known good Current regulating diode die, Current regulating diode flip chip, Current regulating diode die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Current regulating diode, current limiting diode, constant current diode: SMSSST503 Current Regulating Diodes same as Linear Integrated Systems SST503 Linear Integrated Systems SST503 manufactured by Semiconix Semiconductor - Gold chip technology for known good Current regulating diode die, Current regulating diode flip chip, Current regulating diode die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. Linear Integrated Systems SST503 Linear Integrated Systems SST503,SMSSST503,Single,,current regulating diode, current limiting diode, constant current diode, constant-current diode,gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Current regulating diode, current limiting diode, constant current diode: SMSSST503 Current Regulating Diodes same as Linear Integrated Systems SST503 Linear Integrated Systems SST503 manufactured by Semiconix Semiconductor - Gold chip technology for known good Current regulating diode die, Current regulating diode flip chip, Current regulating diode die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Current regulating diode, current limiting diode, constant current diode: SMSSST503 Current Regulating Diodes same as Linear Integrated Systems SST503 Linear Integrated Systems SST503 manufactured by Semiconix Semiconductor - Gold chip technology for known good Current regulating diode die, Current regulating diode flip chip, Current regulating diode die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. Linear Integrated Systems SST503 Linear Integrated Systems SST503,SMSSST503,Single,,current regulating diode, current limiting diode, constant current diode, constant-current diode,gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMSSST503 - FLIP CHIP GOLD CHIP TECHNOLOGY™ Current Regulating Diodes FEATURES APPLICATIONS CURRENT REGULATING DIODES - FLIP CHIP Same as Linear Integrated Systems SST503 SECOND SOURCE FOR SILICONIX SST502 SERIES WIDE CURRENT RANGE 0.43 to 4.7mA BIASING NOT REQUIRED VGS=0V Available in bare die form, flip chip, µDFN, SOT-23 and TO92 Ideal for Current Limiting and Constant Current Applications High reliability Unique new design Gold metallization RoHS compliant, Lead Free Compatible with both chip and wire, flip chip and surface mount assembly. Current limiting Constant current applications Chip on Board System in package SIP Hybrid Circuits SMSSST503 SST503 Current Regulating Diodes Current Regulating Diodes - PRODUCT DESCRIPTION Current regulating diode (also called CLD, current limiting diode, Constant current diode, constant-current diode, diode-connected transistor or current-regulating diode) is actually a JFET with the gate shorted to the source, and it functions like a two-terminal current limiter or current source (analog to voltage limiting Zener diode). They allow a current through them to rise to a certain value, and then level off at a specific value. Flip Chip Current Regulating Diodes series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Maximum Storage Temperature TSTG -55 to +150 °C Maximum Operating Junction Temperature TJ -55 to +135 °C Maximum Continuous Power Dissipation @ +125 °C PD 350 mW Forward Current IF 20 mA Reverse Current IR 50 mA Peak Operating Voltage POV 50 V Electrical Characteristics* TC = 25°C unless otherwise noted Name Symbol Test Conditions Value Unit Min. Typ. Max Forward Current IF VF= 25V 0.448 0.56 0.672 mA Dynamic Impedance Zd VF= 25V 0.7 2 Ω Knee Impedance Zk VF= 6V 0.5 Ω Limiting Voltage Vl IF= 0.8IF(min) 1.7 0.7 V Peak Operating Voltage Pov IF= 1.1IF(max) 45 V Reverse Voltage VF IR=1mA 0.8 V Forward Capacitance CF VF= 25V, f= 1MHz 1.5 pF SPICE MODEL Spice model pending. CROSS REFERENCE PARTS: Linear Integrated Systems SST503 GENERAL DIE INFORMATION Substrate Thickness [mils] Size LxW[mils] Bonding pads dimensions per drawing Backside Silicon 10±2 0402 Type Pad metal Thickness Assembly -FC TiW/Au 4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1 Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process: -FC -GB -GT -AN SMSSST503 Linear Integrated Systems SST503 Linear Integrated Systems SST503 Current Regulating Diodes SMSSST503 Linear Integrated Systems SST503 Linear Integrated Systems SST503 Current Regulating Diodes wire bonding SMSSST503 Linear Integrated Systems SST503 Linear Integrated Systems SST503 Current Regulating Diodesthermosonic SMSSST503 Linear Integrated Systems SST503 Linear Integrated Systems SST503 Current Regulating Diodesthermal SMSSST503 Linear Integrated Systems SST503 Linear Integrated Systems SST503 Current Regulating Diodessolder reflow SMSSST503 Linear Integrated Systems SST503 Linear Integrated Systems SST503 Current Regulating Diodes SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process. Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications. Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Flip chip SMSSST503-FC -WP 10000 -FF 45000 Flip chip SMSSST503-FC -WP 50000 -FF 225000 Gold Bump SMSSST503-GB -WP 10000 -FF 45000 Gold Bump SMSSST503-GB -WP 50000 -FF 225000 Gold-Tin SMSSST503-GT -WP 10000 -FF 45000 Gold-Tin SMSSST503-GT -WP 50000 -FF 225000 Gold/Nickel SMSSST503-AN -WP 10000 -FF 45000 Gold/Nickel SMSSST503-AN -WP 50000 -FF 225000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 17 Screen resolution: 1124x864 Screen resolution: Total site visits: 326577 Color quality: 16 bit Color quality: bit © 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.

REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP     SMSSST503 - FLIP CHIP GOLD CHIP TECHNOLOGY™ Current Regulating Diodes FEATURES APPLICATIONS CURRENT REGULATING DIODES - FLIP CHIP Same as Linear Integrated Systems SST503 SECOND SOURCE FOR SILICONIX SST502 SERIES WIDE CURRENT RANGE 0.43 to 4.7mA BIASING NOT REQUIRED VGS=0V Available in bare die form, flip chip, µDFN, SOT-23 and TO92 Ideal for Current Limiting and Constant Current Applications High reliability Unique new design Gold metallization RoHS compliant, Lead Free Compatible with both chip and wire, flip chip and surface mount assembly. Current limiting Constant current applications Chip on Board System in package SIP Hybrid Circuits Current Regulating Diodes - PRODUCT DESCRIPTION Current regulating diode (also called CLD, current limiting diode, Constant current diode, constant-current diode, diode-connected transistor or current-regulating diode) is actually a JFET with the gate shorted to the source, and it functions like a two-terminal current limiter or current source (analog to voltage limiting Zener diode). They allow a current through them to rise to a certain value, and then level off at a specific value. Flip Chip Current Regulating Diodes series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Maximum Storage Temperature TSTG -55 to +150 °C Maximum Operating Junction Temperature TJ -55 to +135 °C Maximum Continuous Power Dissipation @ +125 °C PD 350 mW Forward Current IF 20 mA Reverse Current IR 50 mA Peak Operating Voltage POV 50 V Electrical Characteristics* TC = 25°C unless otherwise noted Name Symbol Test Conditions Value Unit Min. Typ. Max Forward Current IF VF= 25V 0.448 0.56 0.672 mA Dynamic Impedance Zd VF= 25V 0.7 2 Ω Knee Impedance Zk VF= 6V 0.5 Ω Limiting Voltage Vl IF= 0.8IF(min) 1.7 0.7 V Peak Operating Voltage Pov IF= 1.1IF(max) 45 V Reverse Voltage VF IR=1mA 0.8 V Forward Capacitance CF VF= 25V, f= 1MHz 1.5 pF SPICE MODEL Spice model pending. CROSS REFERENCE PARTS: Linear Integrated Systems SST503 GENERAL DIE INFORMATION Substrate Thickness [mils] Size LxW[mils] Bonding pads dimensions per drawing Backside Silicon 10±2 0402 Type Pad metal Thickness Assembly -FC TiW/Au 4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1 Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process: -FC -GB -GT -AN SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process. Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications. Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Flip chip SMSSST503-FC -WP 10000 -FF 45000 Flip chip SMSSST503-FC -WP 50000 -FF 225000 Gold Bump SMSSST503-GB -WP 10000 -FF 45000 Gold Bump SMSSST503-GB -WP 50000 -FF 225000 Gold-Tin SMSSST503-GT -WP 10000 -FF 45000 Gold-Tin SMSSST503-GT -WP 50000 -FF 225000 Gold/Nickel SMSSST503-AN -WP 10000 -FF 45000 Gold/Nickel SMSSST503-AN -WP 50000 -FF 225000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail     SMSSST503-FC-WP SMSSST503-FC-FF SMSSST503-GB-WP SMSSST503-GB-FF SMSSST503-GT-WP SMSSST503-GT-FF SMSSST503-AN-WP SMSSST503-AN-FF DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)758-8694 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:July 06, 2009 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: Color quality: 16 bit Color quality: bit © 1990-2024 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.