Goldchip technology trademark of Semiconix Corporation for known good die , flip chip , bare die , wafer foundry for discrete semiconductors, , integrated circuits and integrated passive components manufactured by Semiconix Semiconductor,PNP LOW POWER ON SEMICONDUCTOR CROSS REFERENCE, ON Semiconductor,2SA1774-,MSB1218A-RT1-,MSA1162GT1-,MSA1162YT1-,MSB709-RT1-,MSB710-RT1-,BC807-16LT1-,BC807-25LT1-,BC807-40LT1-,BC808-25LT1-,BC808-40LT1-,BC856A-,BC856B-,BC857A-,BC857B-,BC857C-,BC858A-,BC858B-,BC858C-,BC859B-,BC859C-,BCW30LT1-,BCW68GLT1-,BCW70LT1-,BCX17LT1-,BCX18LT1-,MMBT2907ALT1-,MMBT3906LT1-,MMBT4126LT1-,MMBT4403LT1-,MMBT5087LT1-,MMBT5401LT1-,MMBT6520LT1-,MMBTA55LT1-,MMBTA56LT1-,MMBTA70LT1-,MMSTA92-,2SA2029M3T5G-,NS2029M3T5G-,MMBT2131T1-,BC307B-,BC856BDW1T1-,BC857BDW1T1-,BC857C PNP LOW POWER ON SEMICONDUCTOR CROSS REFERENCE, ON Semiconductor,2SA1774-,MSB1218A-RT1-,MSA1162GT1-,MSA1162YT1-,MSB709-RT1-,MSB710-RT1-,BC807-16LT1-,BC807-25LT1-,BC807-40LT1-,BC808-25LT1-,BC808-40LT1-,BC856A-,BC856B-,BC857A-,BC857B-,BC857C-,BC858A-,BC858B-,BC858C-,BC859B-,BC859C-,BCW30LT1-,BCW68GLT1-,BCW70LT1-,BCX17LT1-,BCX18LT1-,MMBT2907ALT1-,MMBT3906LT1-,MMBT4126LT1-,MMBT4403LT1-,MMBT5087LT1-,MMBT5401LT1-,MMBT6520LT1-,MMBTA55LT1-,MMBTA56LT1-,MMBTA70LT1-,MMSTA92-,2SA2029M3T5G-,NS2029M3T5G-,MMBT2131T1-,BC307B-,BC856BDW1T1-,BC857BDW1T1-,BC857C PNP LOW POWER ON SEMICONDUCTOR CROSS REFERENCE, ON Semiconductor,2SA1774-,MSB1218A-RT1-,MSA1162GT1-,MSA1162YT1-,MSB709-RT1-,MSB710-RT1-,BC807-16LT1-,BC807-25LT1-,BC807-40LT1-,BC808-25LT1-,BC808-40LT1-,BC856A-,BC856B-,BC857A-,BC857B-,BC857C-,BC858A-,BC858B-,BC858C-,BC859B-,BC859C-,BCW30LT1-,BCW68GLT1-,BCW70LT1-,BCX17LT1-,BCX18LT1-,MMBT2907ALT1-,MMBT3906LT1-,MMBT4126LT1-,MMBT4403LT1-,MMBT5087LT1-,MMBT5401LT1-,MMBT6520LT1-,MMBTA55LT1-,MMBTA56LT1-,MMBTA70LT1-,MMSTA92-,2SA2029M3T5G-,NS2029M3T5G-,MMBT2131T1-,BC307B-,BC856BDW1T1-,BC857BDW1T1-,BC857C Semiconix Semiconductor designs and manufactures analog devices built on semiconductor linear technology. Semiconix Semiconductor Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing (including thin film vacuum deposition services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is supplying integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.
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semiconix semiconductor - where the future is today - gold chip technology PNP_LOW_POWER
ON SEMICONDUCTOR
CROSS REFERENCE
   

GOLD CHIP TECHNOLOGY™
 
150mW →200mW →225mW →265mW →
342mW →350mW →380mW →625mW →
1000mW →1500mW →

ON SEMICONDUCTOR 150mW pnp low power
2SA1774SMX2SA1774BARE DIEFLIP CHIPnDFN
MSB1218A-RT1SMXMSB1218A-RT1BARE DIEFLIP CHIPnDFN

ON SEMICONDUCTOR 200mW pnp low power
MSA1162GT1SMXMSA1162GT1BARE DIEFLIP CHIPnDFN MSB710-RT1SMXMSB710-RT1BARE DIEFLIP CHIPnDFN
MSA1162YT1SMXMSA1162YT1BARE DIEFLIP CHIPnDFN
MSB709-RT1SMXMSB709-RT1BARE DIEFLIP CHIPnDFN

ON SEMICONDUCTOR 225mW pnp low power
BC807-16LT1SMXBC807-16LT1BARE DIEFLIP CHIPnDFN BCW70LT1SMXBCW70LT1BARE DIEFLIP CHIPnDFN
BC807-25LT1SMXBC807-25LT1BARE DIEFLIP CHIPnDFN BCX17LT1SMXBCX17LT1BARE DIEFLIP CHIPnDFN
BC807-40LT1SMXBC807-40LT1BARE DIEFLIP CHIPnDFN BCX18LT1SMXBCX18LT1BARE DIEFLIP CHIPnDFN
BC808-25LT1SMXBC808-25LT1BARE DIEFLIP CHIPnDFN MMBT2907ALT1SMXMMBT2907ALT1BARE DIEFLIP CHIPnDFN
BC808-40LT1SMXBC808-40LT1BARE DIEFLIP CHIPnDFN MMBT3906LT1SMXMMBT3906LT1BARE DIEFLIP CHIPnDFN
BC856ASMXBC856ABARE DIEFLIP CHIPnDFN MMBT4126LT1SMXMMBT4126LT1BARE DIEFLIP CHIPnDFN
BC856BSMXBC856BBARE DIEFLIP CHIPnDFN MMBT4403LT1SMXMMBT4403LT1BARE DIEFLIP CHIPnDFN
BC857ASMXBC857ABARE DIEFLIP CHIPnDFN MMBT5087LT1SMXMMBT5087LT1BARE DIEFLIP CHIPnDFN
BC857BSMXBC857BBARE DIEFLIP CHIPnDFN MMBT5401LT1SMXMMBT5401LT1BARE DIEFLIP CHIPnDFN
BC857CSMXBC857CBARE DIEFLIP CHIPnDFN MMBT6520LT1SMXMMBT6520LT1BARE DIEFLIP CHIPnDFN
BC858ASMXBC858ABARE DIEFLIP CHIPnDFN MMBTA55LT1SMXMMBTA55LT1BARE DIEFLIP CHIPnDFN
BC858BSMXBC858BBARE DIEFLIP CHIPnDFN MMBTA56LT1SMXMMBTA56LT1BARE DIEFLIP CHIPnDFN
BC858CSMXBC858CBARE DIEFLIP CHIPnDFN MMBTA70LT1SMXMMBTA70LT1BARE DIEFLIP CHIPnDFN
BC859BSMXBC859BBARE DIEFLIP CHIPnDFN MMSTA92SMXMMSTA92BARE DIEFLIP CHIPnDFN
BC859CSMXBC859CBARE DIEFLIP CHIPnDFN
BCW30LT1SMXBCW30LT1BARE DIEFLIP CHIPnDFN
BCW68GLT1SMXBCW68GLT1BARE DIEFLIP CHIPnDFN

ON SEMICONDUCTOR 265mW pnp low power
2SA2029M3T5GSMX2SA2029M3T5GBARE DIEFLIP CHIPnDFN
NS2029M3T5GSMXNS2029M3T5GBARE DIEFLIP CHIPnDFN

ON SEMICONDUCTOR 342mW pnp low power
MMBT2131T1SMXMMBT2131T1BARE DIEFLIP CHIPnDFN

ON SEMICONDUCTOR 350mW pnp low power
BC307BSMXBC307BBARE DIEFLIP CHIPnDFN

ON SEMICONDUCTOR 380mW pnp low power
BC856BDW1T1SMXBC856BDW1T1BARE DIEFLIP CHIPnDFN BC858CDW1T1SMXBC858CDW1T1BARE DIEFLIP CHIPnDFN
BC857BDW1T1SMXBC857BDW1T1BARE DIEFLIP CHIPnDFN
BC857CDW1T1SMXBC857CDW1T1BARE DIEFLIP CHIPnDFN

ON SEMICONDUCTOR 625mW pnp low power
BC327-16SMXBC327-16BARE DIEFLIP CHIPnDFN BC640-16SMXBC640-16BARE DIEFLIP CHIPnDFN
BC327-25SMXBC327-25BARE DIEFLIP CHIPnDFN MPS2907ASMXMPS2907ABARE DIEFLIP CHIPnDFN
BC327-40SMXBC327-40BARE DIEFLIP CHIPnDFN MPS4126SMXMPS4126BARE DIEFLIP CHIPnDFN
BC556BSMXBC556BBARE DIEFLIP CHIPnDFN MPS4250SMXMPS4250BARE DIEFLIP CHIPnDFN
BC557ASMXBC557ABARE DIEFLIP CHIPnDFN MPS6651SMXMPS6651BARE DIEFLIP CHIPnDFN
BC557BSMXBC557BBARE DIEFLIP CHIPnDFN MPS6652SMXMPS6652BARE DIEFLIP CHIPnDFN
BC557CSMXBC557CBARE DIEFLIP CHIPnDFN MPS750SMXMPS750BARE DIEFLIP CHIPnDFN
BC558BSMXBC558BBARE DIEFLIP CHIPnDFN P2N2907ASMXP2N2907ABARE DIEFLIP CHIPnDFN
BC560CSMXBC560CBARE DIEFLIP CHIPnDFN
BC640SMXBC640BARE DIEFLIP CHIPnDFN

ON SEMICONDUCTOR 1000mW pnp low power
MPS6726SMXMPS6726BARE DIEFLIP CHIPnDFN
MPS6727SMXMPS6727BARE DIEFLIP CHIPnDFN
MPSW92SMXMPSW92BARE DIEFLIP CHIPnDFN

ON SEMICONDUCTOR 1500mW pnp low power
PZT2907AT1SMXPZT2907AT1BARE DIEFLIP CHIPnDFN

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