SMX MC34063A DC-DC CONVERTER CONTROL CIRCUITS same as Fairchild Semiconductor MC34063A, ADD Microtech Corp AMC34063A, ADD Microtech Corp AMC34063AM, ADD Microtech Corp AMC34063AM, ADD Microtech Corp AMC34063ADM, ADD Microtech Corp AMC34063ADM, ADD Microtech Corp AMC34063A, Analog Integrations Corporation MC34063A, Analog Integrations Corporation MC34063ACN, Analog Integrations Corporation MC34063ACS, Fairchild Semiconductor MC34063AD, Fairchild Semiconductor MC34063ADX, Fairchild Semiconductor MC34063AP, Fairchild Semiconductor MC34063A, Motorola MC34063A, Motorola MC34063AP1, Motorola MC34063AD, ON Semiconductor MC34063AM, ON Semiconductor MC34063AM, ON Semiconductor MC34063AMEL, ON Semiconductor MC34063AMEL, ON Semiconductor MC34063AM, ON Semiconductor MC34063AMEL, ON Semiconductor MC34063AML1, ON Semiconductor MC34063AML1, ON Semiconductor MC34063AMR2, ON Semiconductor MC34063AMR2, ON Semiconductor MC34063AMR2, ON Semiconductor MC34063AMR1, ON Semiconductor MC34063AMR1, ON Semiconductor MC34063AMR1, ON Semiconductor MC34063AML2, ON Semiconductor MC34063AML2, ON Semiconductor MC34063AML2, ON Semiconductor MC34063AML1, ON Semiconductor MC34063ADR2, ON Semiconductor MC34063ADR2, ON Semiconductor MC34063A, ON Semiconductor MC34063ADR2, ON Semiconductor MC34063A-D, SGS Thomson Microelectronics MC34063ACD, SGS Thomson Microelectronics MC34063ABN, SGS Thomson Microelectronics MC34063ABD-TR, SGS Thomson Microelectronics MC34063ABD, SGS Thomson Microelectronics MC34063A, SGS Thomson Microelectronics MC34063ACD-TR, SGS Thomson Microelectronics MC34063ACN, ST Microelectronics MC34063ACD-TR, ST Microelectronics MC34063ABD, ST Microelectronics MC34063ABD-TR, ST Microelectronics MC34063AB, ST Microelectronics MC34063ABN, ST Microelectronics MC34063AC, ST Microelectronics MC34063ACN, ST Microelectronics MC34063ACD, Texas Instruments MC34063AP, Texas Instruments MC34063ADRJR, Texas Instruments MC34063ADRJR, Texas Instruments MC34063A, Texas Instruments MC34063ADRJR, Texas Instruments MC34063ADR, Texas Instruments MC34063AD, Unisonic Technologies UTCMC34063A manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. ADD Microtech Corp AMC34063A, Analog Integrations Corporation MC34063A, Fairchild Semiconductor MC34063A, Motorola MC34063A, ON Semiconductor MC34063A, SGS Thomson Microelectronics MC34063A, ST Microelectronics MC34063AB, Texas Instruments MC34063A, Unisonic Technologies UTCMC34063A SMX MC34063A DC-DC CONVERTER CONTROL CIRCUITS same as Fairchild Semiconductor MC34063A, ADD Microtech Corp AMC34063A, ADD Microtech Corp AMC34063AM, ADD Microtech Corp AMC34063AM, ADD Microtech Corp AMC34063ADM, ADD Microtech Corp AMC34063ADM, ADD Microtech Corp AMC34063A, Analog Integrations Corporation MC34063A, Analog Integrations Corporation MC34063ACN, Analog Integrations Corporation MC34063ACS, Fairchild Semiconductor MC34063AD, Fairchild Semiconductor MC34063ADX, Fairchild Semiconductor MC34063AP, Fairchild Semiconductor MC34063A, Motorola MC34063A, Motorola MC34063AP1, Motorola MC34063AD, ON Semiconductor MC34063AM, ON Semiconductor MC34063AM, ON Semiconductor MC34063AMEL, ON Semiconductor MC34063AMEL, ON Semiconductor MC34063AM, ON Semiconductor MC34063AMEL, ON Semiconductor MC34063AML1, ON Semiconductor MC34063AML1, ON Semiconductor MC34063AMR2, ON Semiconductor MC34063AMR2, ON Semiconductor MC34063AMR2, ON Semiconductor MC34063AMR1, ON Semiconductor MC34063AMR1, ON Semiconductor MC34063AMR1, ON Semiconductor MC34063AML2, ON Semiconductor MC34063AML2, ON Semiconductor MC34063AML2, ON Semiconductor MC34063AML1, ON Semiconductor MC34063ADR2, ON Semiconductor MC34063ADR2, ON Semiconductor MC34063A, ON Semiconductor MC34063ADR2, ON Semiconductor MC34063A-D, SGS Thomson Microelectronics MC34063ACD, SGS Thomson Microelectronics MC34063ABN, SGS Thomson Microelectronics MC34063ABD-TR, SGS Thomson Microelectronics MC34063ABD, SGS Thomson Microelectronics MC34063A, SGS Thomson Microelectronics MC34063ACD-TR, SGS Thomson Microelectronics MC34063ACN, ST Microelectronics MC34063ACD-TR, ST Microelectronics MC34063ABD, ST Microelectronics MC34063ABD-TR, ST Microelectronics MC34063AB, ST Microelectronics MC34063ABN, ST Microelectronics MC34063AC, ST Microelectronics MC34063ACN, ST Microelectronics MC34063ACD, Texas Instruments MC34063AP, Texas Instruments MC34063ADRJR, Texas Instruments MC34063ADRJR, Texas Instruments MC34063A, Texas Instruments MC34063ADRJR, Texas Instruments MC34063ADR, Texas Instruments MC34063AD, Unisonic Technologies UTCMC34063A manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. ADD Microtech Corp AMC34063A, Analog Integrations Corporation MC34063A, Fairchild Semiconductor MC34063A, Motorola MC34063A, ON Semiconductor MC34063A, SGS Thomson Microelectronics MC34063A, ST Microelectronics MC34063AB, Texas Instruments MC34063A, Unisonic Technologies UTCMC34063A REGISTER-LOGIN PRODUCTS CROSS REFERENCE /cgi-bin/stock.pl?part=MC34063A">INVENTORY /cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXMC34063A&c_item_1=">REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMX MC34063A - BARE DIE GOLD CHIP TECHNOLOGY™ DC-DC CONVERTER CONTROL CIRCUITS FEATURES APPLICATIONS DC-DC CONVERTER CONTROL CIRCUITS Output switch current in excess of 1.5A 2% reference accuracy; Low quiescent current 2.5mA (typ.) Operating from 3V to 40V Frequency operation 100KHz Active current limiting In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS MC34063A MC34063A DC-DC CONVERTER CONTROL CIRCUITS SMXMC34063A DC-DC CONVERTER CONTROL CIRCUITS - PRODUCT DESCRIPTION The SMX MC34063A series is a monolithic control circuit delivering the main functions for DC-DC voltage converting. The device contains an internal temperature compensated reference, comparator, duty cycle controlled oscillator with an active current limit circuit, driver and high current output switch. Output voltage is adjustable through two external resistors with a 2% reference accuracy. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions. SCHEMATIC DIAGRAM MC34063A Fairchild Semiconductor MC34063A DC-DC CONVERTER CONTROL CIRCUITS MC34063A MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Power Supply Voltages VCC 40 Vdc Comparator Input Voltage Range Vir -0.3 to +40 Vdc Switch Collector Voltage Vc(switch) 40 Vdc Switch Emitter Voltage (VPin1= 40V) Ve(switch) 40 Vdc Switch Collector to Emitter Voltage Vce(switch) 40 Vdc Driver Collector Voltage Vc(driver) 40 Vdc Driver Collector Current (Note 1.) Ic(driver) 100 mA Switch Current Isw 1.5 A Operating Junction Temperature Tj 150 °C Operating Ambient Temperature Range Ta 0 to +70 °C Storage Temperature Range Tstg -65 to +150 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. MC34063A ELECTRICAL CHARACTERISTIC T=25°C unless otherwise specified PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS OSCILATOR Frequency VPin5=0V, CT=1.0nF, TA=25°C fOSC 24 33 42 KHZ Charge Current VCC=5.0V to 40V, TA=25°C Ichg 24 35 42 µA Discharge Current VCC=5.0V to 40 V, TA=25°C Idischg 140 220 260 µA Discharge to Charge Current Ratio Pin 7 to VCC, TA=25°C Idischg/Ichg 5.2 6.5 7.5 Current Limit Sense Voltage Ichg=Idischg, TA=25°C VIpk(sense) 250 300 360 mV OUTPUT SWITCH (Note 1) Saturation Voltage, Darlington Connection ISW=1.0A, Pins 1, 8 connected VCE(sat) 1 1.3 V Saturation Voltage ISW=1.0A, RPin8=82 to VCC, Forced ß20 VCE(sat) 0.45 0.7 V DC Current Gain ISW=1.0A,VCE=5.0V,TA=25°C hFE 50 75 Collector Off-State Current VCE=40V IC(off) 0.01 100 µA COMPARATOR Threshold Voltage TA=25°C; TA=Tlow to Thigh Vth 1.225 1.21 1.25 - 1.275 1.29 V Threshold Voltage Line Regulation VCC=3.0 V to 40 V Regline 1.4 5 mV Input Bias Current Vin=0V IIB -20 -400 nA TOTAL DEVICE Supply Current VCC=5.0 V to 40 V, CT=1.0 nF, Pin 7=VCC, VPin5>Vth, Pin2=GND, Remaining pins open ICC 4 mA (NOTE 1)Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible. SPICE MODEL CROSS REFERENCE PARTS GENERAL DIE INFORMATION Substrate Thickness [mils] Die size mils [mm] Bonding pads Backside metallization Silicon 10 67.7 x 71.6 ±1 [1.72 x 1.82] min 4x4 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. MC34063A DIE LAYOUT - MECHANICAL SPECIFICATIONS MC34063A DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # 1 2 3 4 5 6 7 8 SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000. MC34063A STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USM MC34063A 100pc -WP $3.20 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES /cgi-bin/getpdf.pl?part=SMXMC34063A&idx=16">PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated: Display settings for best viewing: Current display settings: Page hits: Screen resolution: 1124x864 Screen resolution: Total site visits: Color quality: 16 bit Color quality: bit © 1990- SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission. Valid XHTML 1.0 Transitional by http://validator.w3.org

REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP

   
semiconix semiconductor - where the future is today - gold chip technology SMX MC34063A - BARE DIE
GOLD CHIP TECHNOLOGY™ DC-DC CONVERTER CONTROL CIRCUITS

FEATURES APPLICATIONS DC-DC CONVERTER CONTROL CIRCUITS
Output switch current in excess of 1.5A
2% reference accuracy; Low quiescent current 2.5mA (typ.)
Operating from 3V to 40V
Frequency operation 100KHz
Active current limiting




In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS









MC34063A MC34063A DC-DC CONVERTER CONTROL CIRCUITS

SMXMC34063A DC-DC CONVERTER CONTROL CIRCUITS - PRODUCT DESCRIPTION
The SMX MC34063A series is a monolithic control circuit delivering the main functions for DC-DC voltage converting. The device contains an internal temperature compensated reference, comparator, duty cycle controlled oscillator with an active current limit circuit, driver and high current output switch. Output voltage is adjustable through two external resistors with a 2% reference accuracy.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS
Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions.


SCHEMATIC DIAGRAM
MC34063A Fairchild Semiconductor MC34063A DC-DC CONVERTER CONTROL CIRCUITS

MC34063A MAXIMUM RATINGS
PARAMETERSYMBOLVALUEUNITS
Power Supply VoltagesVCC40Vdc
Comparator Input Voltage RangeVir-0.3 to +40Vdc
Switch Collector VoltageVc(switch)40Vdc
Switch Emitter Voltage (VPin1= 40V)Ve(switch)40Vdc
Switch Collector to Emitter VoltageVce(switch)40Vdc
Driver Collector VoltageVc(driver)40Vdc
Driver Collector Current (Note 1.)Ic(driver)100mA
Switch CurrentIsw1.5A
Operating Junction TemperatureTj150°C
Operating Ambient Temperature RangeTa0 to +70°C
Storage Temperature RangeTstg-65 to +150°C
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

MC34063A ELECTRICAL CHARACTERISTIC
T=25°C unless otherwise specified
PARAMETERTEST CONDITIONSSYMBOLMINTYPMAXUNITS
OSCILATOR
FrequencyVPin5=0V, CT=1.0nF, TA=25°CfOSC243342KHZ
Charge CurrentVCC=5.0V to 40V, TA=25°CIchg243542µA
Discharge CurrentVCC=5.0V to 40 V, TA=25°CIdischg140220260µA
Discharge to Charge Current RatioPin 7 to VCC, TA=25°CIdischg/Ichg5.26.57.5
Current Limit Sense VoltageIchg=Idischg, TA=25°CVIpk(sense)250300360mV
OUTPUT SWITCH (Note 1)
Saturation Voltage, Darlington ConnectionISW=1.0A, Pins 1, 8 connectedVCE(sat)11.3V
Saturation VoltageISW=1.0A, RPin8=82 to VCC, Forced ß20VCE(sat)0.450.7V
DC Current GainISW=1.0A,VCE=5.0V,TA=25°ChFE5075
Collector Off-State CurrentVCE=40VIC(off)0.01100µA
COMPARATOR
Threshold VoltageTA=25°C; TA=Tlow to ThighVth1.225 1.211.25 -1.275 1.29V
Threshold Voltage Line RegulationVCC=3.0 V to 40 VRegline1.45mV
Input Bias CurrentVin=0VIIB-20-400nA
TOTAL DEVICE
Supply CurrentVCC=5.0 V to 40 V, CT=1.0 nF, Pin 7=VCC, VPin5>Vth, Pin2=GND, Remaining pins openICC4mA
(NOTE 1)Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible.

SPICE MODEL
Spice model pending.
 
CROSS REFERENCE PARTS
ADD Microtech Corp AMC34063A, Analog Integrations Corporation MC34063A, Fairchild Semiconductor MC34063A, Motorola MC34063A, ON Semiconductor MC34063A, SGS Thomson Microelectronics MC34063A, ST Microelectronics MC34063AB, Texas Instruments MC34063A, Unisonic Technologies UTCMC34063A

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Die size
mils [mm]
Bonding pads Backside metallization
Silicon 10 67.7 x 71.6 ±1
[1.72 x 1.82]
min 4x4 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.

MC34063A DIE LAYOUT - MECHANICAL SPECIFICATIONSMC34063A DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD #
1
2
3
4
5
6
7
8

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization.
For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au.
For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used.
In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000.

MC34063A STANDARD PRODUCTS PRICE LIST
USM PART #MINIMUM ORDER QUANTITYWaffle PacksU/P($)
USM MC34063A100pc-WP$3.20
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONIX SEMICONDUCTOR technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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