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SMX LM7805 5V POSITIVE VOLTAGE REGULATOR DIE FOR HYBRID CIRCUITS same as National Semiconductor LM7805, Fairchild Semiconductor LM7805, Fairchild Semiconductor LM7805A, Fairchild Semiconductor LM7805A, Fairchild Semiconductor LM7805I, Fairchild Semiconductor LM7805I, Fairchild Semiconductor LM7805CT, Fairchild Semiconductor LM7805ECT, Fairchild Semiconductor LM7805E, National Semiconductor LM7805CT, National Semiconductor LM7805CK, National Semiconductor LM7805C, Unisonic Technologies UTCLM7805 manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire.
Fairchild Semiconductor LM7805, National Semiconductor LM7805C, Unisonic Technologies UTCLM7805
SMX LM7805 5V POSITIVE VOLTAGE REGULATOR DIE FOR HYBRID CIRCUITS same as National Semiconductor LM7805, Fairchild Semiconductor
LM7805, Fairchild Semiconductor LM7805A, Fairchild Semiconductor LM7805A, Fairchild Semiconductor LM7805I, Fairchild Semiconductor LM7805I,
Fairchild Semiconductor LM7805CT, Fairchild Semiconductor LM7805ECT, Fairchild Semiconductor LM7805E, National Semiconductor LM7805CT,
National Semiconductor LM7805CK, National Semiconductor LM7805C, Unisonic Technologies UTCLM7805 manufactured by Semiconix Semiconductor -
Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated
passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip,
bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix
Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package
applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. Fairchild
Semiconductor LM7805, National Semiconductor LM7805C, Unisonic Technologies UTCLM7805 REGISTER-LOGIN PRODUCTS CROSS REFERENCE
/cgi-bin/stock.pl?part=LM7805">INVENTORY /cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXLM7805&c_item_1=">REQUEST QUOTE
smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip
technology SMX LM7805 - BARE DIE GOLD CHIP TECHNOLOGY™ 5V POSITIVE VOLTAGE REGULATOR DIE FOR HYBRID CIRCUITS FEATURES APPLICATIONS VOLTAGE
REGULATOR Output Current in Excess of 1A Output Voltages of +5V Internal Thermal Overload Protection Short Circuit Protection Output
Transistor Safe Operating area Compensation In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS
LM7805 LM7805 5V POSITIVE VOLTAGE REGULATOR DIE FOR HYBRID CIRCUITS SMXLM7805 5V POSITIVE VOLTAGE REGULATOR DIE FOR HYBRID CIRCUITS -
PRODUCT DESCRIPTION SMX 7805 is a 3-terminal positive voltage regulator designed with built in internal current limiting, thermal shutdown
and safe-area compensation for maximum flexibility and safety . With adequate heat sinking provided, SMX LM7805 can deliver up to 1.5A
output current. SMX LM7805 can be used as fixed voltage regulator in a wide range of applications where local voltage regulation is
preferred for elimination of noise and distribution problems associated with single-point regulation. SMX LM7805 can also be used (by
adding external components) to obtain adjustable output voltages and currents. It is not necessary to bypass the output, although this does
improve transient response. Input bypassing is needed only if the regulator is located far from the filter capacitor of the power supply.
SMX LM7805 is available in die form only. The die size is 80x80mils. The die thickness is 12 mils 2mils. The bond pad metallization is
standard 1µm Aluminum. The backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. HIGH
RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven
mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC
(System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework,
use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions
without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental
conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads
that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products
and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the
die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high
reliability SIP solution for medical, military and space applications. See AN-SMX-001 SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING
PROCESS Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes.
All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts
and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film
resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions.
SCHEMATIC DIAGRAM LM7805 National Semiconductor LM7805 5V POSITIVE VOLTAGE REGULATOR DIE FOR HYBRID CIRCUITS LM7805 MAXIMUM RATINGS
PARAMETER SYMBOL VALUE UNITS Internal Power Dissipation (Note1) Pd internally limited W Input Voltage Vin 35 V Maximum Junction Temperature
Tj 150 °C Operating Junction Temperature Range Tj 0 to 150 °C Storage Temperature Range Tstg -65 to +150 °C ESD Susceptibility 2 ONLY
Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage
to the device. LM7805 ELECTRICAL CHARACTERISTIC 55°C<Tj<+150°C, Vi = 14V, Io = 550mA, Ci = 0.33µF, Co= 0.1µF, unless otherwise specified
PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS Output Voltage Tj=25 ° C VO 4.8 5 5.2 V Line Regulation Tj=25°C 7.0V<Vi<25V 8.0V<Vi<20V
ΔVO 3 50 50 mV Load Regulation Tj = 25 °C 5.0mA<IO<1.5A 250mA<IO< 750mA ΔVO 10 50 25 mV Output Voltage 7.5V<Vi<20V, 5.0mA <Io<1.0A, P<15W
Vo 4.75 5.25 mV Quiescent Current Tj = 25 °C Iq 8 8.5 mA Quiescent Current With Line With Load 7.5V<Vi<20V 5.0mA<Io<1.0A DIq 1.0 1.0 mA
Noise Ta=25°C, 10Hz<f<100kHz Vn 40 µV Ripple Rejection f=120Hz, Io=350mA, Tj=25°C ΔV1/ΔVo 62 80 dB Dropout Voltage Io=1.0A, Tj=25°C Vdo 2.0
V Output Resistance f=1.0kHz Ro 8 mW Output Short Circuit Current Tj = 25°C, Vj = 35V Ios 2.1 A Average Temperature Coefficient of Output
Voltage 55°C<Ta<+250°C, Io<5mA ΔVo/ΔT 0.6 -4 mV/°C (NOTE 1)Load and line regulation are specified at constant junction temperature.
Changes in Vo due to heating effects have to be added to those due to the Io. The device should be subject to low duty cycle pulses ONLY.
(NOTE 2)All characteristics are measured with a 0.22µF capacitor from input to ground and a 0.1µF capacitor from output to ground. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tw<10ms, duty cycle<5%). Output
voltage changes due to changes in internal temperature must be taken into account separately. SPICE MODEL CROSS REFERENCE PARTS GENERAL DIE
INFORMATION Substrate Thickness [mils] Die size mils [mm] Bonding pads Backside metallization Silicon 10 78.74 x 78.74 ±1 [2 x 2] min 4x4
mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. LM7805
DIE LAYOUT - MECHANICAL SPECIFICATIONS LM7805 DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) 1 Ground 67.322
1.71 5.118 2 Input 65.598 1.59 32.086 3 Output 27.16 0.69 66.338 4 Output 7.48 0.19 67.322 SEMICONDUCTOR ASSEMBLY PROCESS - SHORT
APPLICATION NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For
AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside
metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au,
Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is
recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague.
Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and
assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of
formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure.
See Application note AN-SMX-000. LM7805 STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USM7805
$320/100pc. -WP $3.20 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are
subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification
requirements, different packaging or custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT
QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However,
no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use.
SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized
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aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES
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