SMX LM431 ADJUSTABLE PRECISION SHUNT REGULATOR same as Fairchild Semiconductor LM431, Fairchild Semiconductor LM431SCCML, Fairchild Semiconductor LM431CIM, Fairchild Semiconductor LM431CCZX, Fairchild Semiconductor LM431CCZ, Fairchild Semiconductor LM431CCMX, Fairchild Semiconductor LM431CCM, Fairchild Semiconductor LM431C, Fairchild Semiconductor LM431BIZX, Fairchild Semiconductor LM431BIZ, Fairchild Semiconductor LM431BIMX, Fairchild Semiconductor LM431BIM, Fairchild Semiconductor LM431BCZX, Fairchild Semiconductor LM431BCZ, Fairchild Semiconductor LM431BCMX, Fairchild Semiconductor LM431BCM, Fairchild Semiconductor LM431SCCMLX, Fairchild Semiconductor LM431CIMX, Fairchild Semiconductor LM431SCCMFX, Fairchild Semiconductor LM431SCCMF, Fairchild Semiconductor LM431SC, Fairchild Semiconductor LM431SBCMLX, Fairchild Semiconductor LM431SBCML, Fairchild Semiconductor LM431SBCMFX, Fairchild Semiconductor LM431SBCMF, Fairchild Semiconductor LM431SB, Fairchild Semiconductor LM431SACMLX, Fairchild Semiconductor LM431SACML, Fairchild Semiconductor LM431SACMFX, Fairchild Semiconductor LM431SACMF, Fairchild Semiconductor LM431SA, Fairchild Semiconductor LM431CIZ, Fairchild Semiconductor LM431B, Fairchild Semiconductor LM431AIZ, Fairchild Semiconductor LM431, Fairchild Semiconductor LM431ACZX, Fairchild Semiconductor LM431ACZ, Fairchild Semiconductor LM431ACN, Fairchild Semiconductor LM431AIM, Fairchild Semiconductor LM431ACMX, Fairchild Semiconductor LM431ACZXA, Fairchild Semiconductor LM431A, Fairchild Semiconductor LM431ACM, Fairchild Semiconductor LM431AIMX, National Semiconductor LM431ACM, National Semiconductor LM431ACZ, National Semiconductor LM431CCZ, National Semiconductor LM431, National Semiconductor LM431CCMX, National Semiconductor LM431CIM3, National Semiconductor LM431CIM3N1A, National Semiconductor LM431A, National Semiconductor LM431CIM3X, National Semiconductor LM431ACMX, National Semiconductor LM431CIMX, National Semiconductor LM431AC MDC, National Semiconductor LM431CIZ, National Semiconductor LM431CIM, National Semiconductor LM431ACM3X, National Semiconductor LM431ACM3, National Semiconductor LM431CCM3X, National Semiconductor LM431CCM3N1B, National Semiconductor LM431AIM3, National Semiconductor LM431BCZ, National Semiconductor LM431AIM3N1E, National Semiconductor LM431BCMX, National Semiconductor LM431AIM3X, National Semiconductor LM431BCM3X, National Semiconductor LM431BCM3N1D, National Semiconductor LM431BCM3, National Semiconductor LM431BCM, National Semiconductor LM431AIMX, National Semiconductor LM431AIZ, National Semiconductor LM431AIM, National Semiconductor LM431BIM, National Semiconductor LM431BIM3, National Semiconductor LM431CCM3, National Semiconductor LM431CCM, National Semiconductor LM431ACM3N1F, National Semiconductor LM431AIBP, National Semiconductor LM431BIZ, National Semiconductor LM431AIBPX, National Semiconductor LM431BIMX, National Semiconductor LM431BIM3X, National Semiconductor LM431BIM3N1C, Philips LM431ACM, Philips LM431ACZU, Philips LM431AC, Philips LM431ACZ, Philips LM431, Philips LM431ACMD manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. Fairchild Semiconductor LM431, National Semiconductor LM431, Philips LM431 SMX LM431 ADJUSTABLE PRECISION SHUNT REGULATOR same as Fairchild Semiconductor LM431, Fairchild Semiconductor LM431SCCML, Fairchild Semiconductor LM431CIM, Fairchild Semiconductor LM431CCZX, Fairchild Semiconductor LM431CCZ, Fairchild Semiconductor LM431CCMX, Fairchild Semiconductor LM431CCM, Fairchild Semiconductor LM431C, Fairchild Semiconductor LM431BIZX, Fairchild Semiconductor LM431BIZ, Fairchild Semiconductor LM431BIMX, Fairchild Semiconductor LM431BIM, Fairchild Semiconductor LM431BCZX, Fairchild Semiconductor LM431BCZ, Fairchild Semiconductor LM431BCMX, Fairchild Semiconductor LM431BCM, Fairchild Semiconductor LM431SCCMLX, Fairchild Semiconductor LM431CIMX, Fairchild Semiconductor LM431SCCMFX, Fairchild Semiconductor LM431SCCMF, Fairchild Semiconductor LM431SC, Fairchild Semiconductor LM431SBCMLX, Fairchild Semiconductor LM431SBCML, Fairchild Semiconductor LM431SBCMFX, Fairchild Semiconductor LM431SBCMF, Fairchild Semiconductor LM431SB, Fairchild Semiconductor LM431SACMLX, Fairchild Semiconductor LM431SACML, Fairchild Semiconductor LM431SACMFX, Fairchild Semiconductor LM431SACMF, Fairchild Semiconductor LM431SA, Fairchild Semiconductor LM431CIZ, Fairchild Semiconductor LM431B, Fairchild Semiconductor LM431AIZ, Fairchild Semiconductor LM431, Fairchild Semiconductor LM431ACZX, Fairchild Semiconductor LM431ACZ, Fairchild Semiconductor LM431ACN, Fairchild Semiconductor LM431AIM, Fairchild Semiconductor LM431ACMX, Fairchild Semiconductor LM431ACZXA, Fairchild Semiconductor LM431A, Fairchild Semiconductor LM431ACM, Fairchild Semiconductor LM431AIMX, National Semiconductor LM431ACM, National Semiconductor LM431ACZ, National Semiconductor LM431CCZ, National Semiconductor LM431, National Semiconductor LM431CCMX, National Semiconductor LM431CIM3, National Semiconductor LM431CIM3N1A, National Semiconductor LM431A, National Semiconductor LM431CIM3X, National Semiconductor LM431ACMX, National Semiconductor LM431CIMX, National Semiconductor LM431AC MDC, National Semiconductor LM431CIZ, National Semiconductor LM431CIM, National Semiconductor LM431ACM3X, National Semiconductor LM431ACM3, National Semiconductor LM431CCM3X, National Semiconductor LM431CCM3N1B, National Semiconductor LM431AIM3, National Semiconductor LM431BCZ, National Semiconductor LM431AIM3N1E, National Semiconductor LM431BCMX, National Semiconductor LM431AIM3X, National Semiconductor LM431BCM3X, National Semiconductor LM431BCM3N1D, National Semiconductor LM431BCM3, National Semiconductor LM431BCM, National Semiconductor LM431AIMX, National Semiconductor LM431AIZ, National Semiconductor LM431AIM, National Semiconductor LM431BIM, National Semiconductor LM431BIM3, National Semiconductor LM431CCM3, National Semiconductor LM431CCM, National Semiconductor LM431ACM3N1F, National Semiconductor LM431AIBP, National Semiconductor LM431BIZ, National Semiconductor LM431AIBPX, National Semiconductor LM431BIMX, National Semiconductor LM431BIM3X, National Semiconductor LM431BIM3N1C, Philips LM431ACM, Philips LM431ACZU, Philips LM431AC, Philips LM431ACZ, Philips LM431, Philips LM431ACMD manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. Fairchild Semiconductor LM431, National Semiconductor LM431, Philips LM431 REGISTER-LOGIN PRODUCTS CROSS REFERENCE /cgi-bin/stock.pl?part=LM431">INVENTORY /cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXLM431&c_item_1=">REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMX LM431 - BARE DIE GOLD CHIP TECHNOLOGY™ ADJUSTABLE PRECISION SHUNT REGULATOR FEATURES APPLICATIONS ADJUSTABLE PRECISION SHUNT REGULATOR Average temperature coefficient 50ppm/°C Temperature compensated for operation over the full temperature range Programmable output voltage Fast turn-on response Low output noise In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS. LM431 LM431 ADJUSTABLE PRECISION SHUNT REGULATOR SMXLM431 ADJUSTABLE PRECISION SHUNT REGULATOR - PRODUCT DESCRIPTION The SMX LM431 is a 3-terminal adjustable shunt regulator with guaranteed temperature stability over the entire temperature range of operation. It is now available in a chip sized package(4-Bump micro SMD )using National’s micro SMD package technology. The output voltage may be set at any level greater than 2.5V (VREF) up to 36V merely by selecting two external resistors that act as a voltage divided network.Due to the sharp turn-on characteristics this device is an excellent replacement for many zener diode applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions. SCHEMATIC DIAGRAM LM431 Fairchild Semiconductor LM431 ADJUSTABLE PRECISION SHUNT REGULATOR LM431 MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Storage Temperature Range Tstg 65 to +150 °C Operating Temperature Range Industrial (LM431xl) Commercial (LM431xC) Top 40 to +85 0 to +70 °C Infrared or Convection (20sec.) 235 °C Wave Soldering (10sec.) lead temperature 260 °C Cathode Voltage Vk 37 V ContinuousCathodeCurrent Ik -10 to +150 mA Reference Voltage Vref -0.5 V Reference Input Current Iref 10 mA ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. LM431 ELECTRICAL CHARACTERISTIC TA=25°C unless otherwise specificed PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS Reference Voltage VZ=VREF,II =10mA LM431A VZ=VREF,II=10mA LM431B VZ=VREF,II=10mA LM431C VREF 2.440 2.470 2.485 2.495 2.495 2.500 2.550 2.520 2.510 V Deviation of Reference Input Voltage Over Temperature (Note5) VZ=VREF,II=10mA TA= Full Range VDEV 8 17 mV Ratio of the Change in Reference Voltage to the Change in Cathode Voltage IZ=10mA, VZ from VREF to10V (AS431B) VZ from 10V to 36V ΔVREF/ΔVZ -1.4 -1.0 -2.7 -2.0 mV/V Reference Input Current R1=10kΩ,R2=0,IL =10mA(LM431B) IREF 2 4 µA Deviation of Reference Input Current over Temperature R1=10kΩ ,R2=0,IL=10mA,TA=Full Range(AS431B) µIREF 0.4 1.2 µA Minimum Cathode Current for Regulation VZ=VREF(LM431A) IZ(MIN) 0.4 1 µA Off-State Current VZ=36V,VREF =0V(LM431C) IZ(OFF) 0.3 1 µA Dynamic Output Impedance (Note6) VZ=VREF Frequency=0 Hz (LM431A) VZ=VREF Frequency=0 Hz (LM431B,LM431C) rZ 0.75 0.50 Ω (NOTE 1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions. (NOTE 2) Tjmax=150 °C (NOTE 3) Ratings apply to ambient temperature at 25°C. Above this temperature, derate the TO-92 at 6.2mW/°C, the SO-8 at 6.5mW/°C, the SOT-23 at 2.2mW/°C and the micro SMD at 3mW/°C (NOTE 4) Deviation of reference input voltage,VDEV,is defined as the maximum variation of the reference input voltage over the full temperature range. SPICE MODEL CROSS REFERENCE PARTS GENERAL DIE INFORMATION Substrate Thickness [mils] Die size mils [mm] Bonding pads Backside metallization Silicon 10 40.5 x 33.5 ±1 [1.03 x 0.85] min 4x4 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. LM431 DIE LAYOUT - MECHANICAL SPECIFICATIONS LM431 DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) 1 Reference 0.159 6.26 0.158 2 Anode 0.524 20.63 0.203 3 Cathode 0.872 34.331 0.158 SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000. LM431 STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USMAS431 100pc -WP $3.20 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES /cgi-bin/getpdf.pl?part=SMXLM431&idx=1">PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated: Display settings for best viewing: Current display settings: Page hits: Screen resolution: 1124x864 Screen resolution: Total site visits: Color quality: 16 bit Color quality: bit © 1990- SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission. Valid XHTML 1.0 Transitional by http://validator.w3.org

REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP

   
semiconix semiconductor - where the future is today - gold chip technology SMX LM431 - BARE DIE
GOLD CHIP TECHNOLOGY™ ADJUSTABLE PRECISION SHUNT REGULATOR

FEATURES APPLICATIONS ADJUSTABLE PRECISION SHUNT REGULATOR
Average temperature coefficient 50ppm/°C
Temperature compensated for operation over the full temperature range
Programmable output voltage
Fast turn-on response
Low output noise




In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS.









LM431 LM431 ADJUSTABLE PRECISION SHUNT REGULATOR

SMXLM431 ADJUSTABLE PRECISION SHUNT REGULATOR - PRODUCT DESCRIPTION
The SMX LM431 is a 3-terminal adjustable shunt regulator with guaranteed temperature stability over the entire temperature range of operation. It is now available in a chip sized package(4-Bump micro SMD )using National’s micro SMD package technology. The output voltage may be set at any level greater than 2.5V (VREF) up to 36V merely by selecting two external resistors that act as a voltage divided network.Due to the sharp turn-on characteristics this device is an excellent replacement for many zener diode applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS
Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions.


SCHEMATIC DIAGRAM
LM431 Fairchild Semiconductor LM431 ADJUSTABLE PRECISION SHUNT REGULATOR

LM431 MAXIMUM RATINGS
PARAMETERSYMBOLVALUEUNITS
Storage Temperature RangeTstg65 to +150°C
Operating Temperature Range Industrial (LM431xl) Commercial (LM431xC)Top 40 to +85 0 to +70°C
Infrared or Convection (20sec.) 235°C
Wave Soldering (10sec.) lead temperature 260°C
Cathode VoltageVk37V
ContinuousCathodeCurrentIk-10 to +150mA
Reference VoltageVref-0.5V
Reference Input CurrentIref10mA
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

LM431 ELECTRICAL CHARACTERISTIC
TA=25°C unless otherwise specificed
PARAMETERTEST CONDITIONSSYMBOLMINTYPMAXUNITS
Reference VoltageVZ=VREF,II =10mA LM431A VZ=VREF,II=10mA LM431B VZ=VREF,II=10mA LM431CVREF2.440 2.470 2.4852.495 2.495 2.5002.550 2.520 2.510V
Deviation of Reference Input Voltage Over Temperature (Note5)VZ=VREF,II=10mA TA= Full RangeVDEV817mV
Ratio of the Change in Reference Voltage to the Change in Cathode VoltageIZ=10mA, VZ from VREF to10V (AS431B) VZ from 10V to 36VΔVREF/ΔVZ-1.4 -1.0-2.7 -2.0mV/V
Reference Input CurrentR1=10kΩ,R2=0,IL =10mA(LM431B)IREF24µA
Deviation of Reference Input Current over TemperatureR1=10kΩ ,R2=0,IL=10mA,TA=Full Range(AS431B)µIREF0.41.2µA
Minimum Cathode Current for RegulationVZ=VREF(LM431A)IZ(MIN)0.41µA
Off-State CurrentVZ=36V,VREF =0V(LM431C)IZ(OFF)0.31µA
Dynamic Output Impedance (Note6)VZ=VREF Frequency=0 Hz (LM431A) VZ=VREF Frequency=0 Hz (LM431B,LM431C)rZ0.75 0.50Ω
(NOTE 1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions.
(NOTE 2) Tjmax=150 °C
(NOTE 3) Ratings apply to ambient temperature at 25°C. Above this temperature, derate the TO-92 at 6.2mW/°C, the SO-8 at 6.5mW/°C, the SOT-23 at 2.2mW/°C and the micro SMD at 3mW/°C
(NOTE 4) Deviation of reference input voltage,VDEV,is defined as the maximum variation of the reference input voltage over the full temperature range.

SPICE MODEL
Spice model pending.
 
CROSS REFERENCE PARTS
Fairchild Semiconductor LM431, National Semiconductor LM431, Philips LM431

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Die size
mils [mm]
Bonding pads Backside metallization
Silicon 10 40.5 x 33.5 ±1
[1.03 x 0.85]
min 4x4 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.

LM431 DIE LAYOUT - MECHANICAL SPECIFICATIONSLM431 DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD #FUNCTIONX(mils)X(mm)Y(mils)
1Reference0.1596.260.158
2Anode0.52420.630.203
3Cathode0.87234.3310.158

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization.
For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au.
For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used.
In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000.

LM431 STANDARD PRODUCTS PRICE LIST
USM PART #MINIMUM ORDER QUANTITYWaffle PacksU/P($)
USMAS431100pc-WP$3.20
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONIX SEMICONDUCTOR technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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