Low Drop Voltage Regulators: SMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V SOIC8 AMS Advanced Monolithic Systems AMS3107N-3.3V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V SOIC8 AMS Advanced Monolithic Systems AMS3107N-3.3V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOIC8 AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V,SMS3107N-3.3V,500mA Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Low Drop Voltage Regulators: SMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V SOIC8 AMS Advanced Monolithic Systems AMS3107N-3.3V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V SOIC8 AMS Advanced Monolithic Systems AMS3107N-3.3V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOIC8 AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V,SMS3107N-3.3V,500mA Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMS3107N-3.3V - FLIP CHIP GOLD CHIP TECHNOLOGY™ 500mA LOW DROPOUT VOLTAGE REGULATOR FEATURES APPLICATIONS 500mA Low Drop Voltage Regulators - FLIP CHIP Fixed and Adjustable Versions Available Output Current in excess of 300mA Very Low Quiescent Current Reverse Battery Protection Input-output Differential less than 0.6V Short Circuit Protection Internal Thermal Overload Protection Load Dump Protection Overvoltage Protection Mirror Image Insertion Protection High reliability Unique new design in 1206 style case Gold metallization RoHS compliant, Lead Free Compatible with both chip and wire, flip chip and surface mount assembly. Cellular Telephones Portable Consumer Equipment Portable (Notebook) Computers Battery Powered Systems Portable Instrumentation Radio Control Systems CD/DVD drives Automotive Low Voltage Systems MP3 Player Chip on Board System in package SIP Hybrid Circuits SMS3107N-3.3V AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR 500mA LOW DROPOUT VOLTAGE REGULATOR - PRODUCT DESCRIPTION SMS3107 series consists of positive fixed and adjustable voltage regulators ideally suited for use in battery-powered systems. These devices feature very low quiescent current of 0.8mA or less when supplying 50mA loads. This unique characteristic and the extremely low input-output differential required for proper regulation (0.2V for output currents of 100mA) make the SMS3107 ideal to use for standby power systems. Internal circuitry of SMS3107 is protected from input fault conditions caused by reverse battery installation or input voltages that exceed maximum rated input voltage. During line transients, such as load dump (40V) when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both internal circuits and the load. The SMS3107 series also includes internal current limiting, thermal shutdown, and is able to withstand temporary power-up with mirror-image insertion. The SMS3107 is offered in the 3-pin TO-92 package, SOT-89, SOT-223, TO-252 and 8 lead SOIC packages and operates over the industrial temperature range. Flip Chip Low Drop Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Power Dissipation Internally limited Operating Voltage Range 25 V Overvoltage Protection 26V to 40V Storage Temperature -65 to +150 °C Operating Junction Temperature -40 to +125 °C Electrical Characteristics* at VIN=6.3V, IO=5mA, TJ=25°C, C2=22µF unless otherwise specified. Name Symbol Test Conditions Value Unit Min. Typ. Max Output Voltage Tolerance -3 3 % Line Regulation 6V≤VIN≤15V 5 10 mV Line Regulation 15V≤VIN≤25V 5 15 mV Load Regulation 5mA≤IO≤100 mA 5 15 mV Load Regulation 5mA≤10≤200 mA 15 20 mV Load Regulation 5mA≤10≤350 mA 20 25 mV Load Regulation 5mA≤10≤500 mA 20 30 mV Dropout Voltage (VIN - VOUT) IO=100 mA 0.25 0.3 mV Dropout Voltage (VIN - VOUT) IO=200 mA 0.4 0.5 mV Dropout Voltage (VIN - VOUT) IO=350 mA 0.45 0.55 mV Dropout Voltage (VIN - VOUT) IO=500 mA 0.55 0.7 mV Quiescent Current IO≤10 mA, 0.2 0.3 mA Quiescent Current IO=100 mA 2 3 mA Quiescent Current IO≤200 mA 5 8 mA Quiescent Current IO=350 mA 12 mA Shutdown Quiescent Current,over the full operating temperature range. 80 dB Output Noise Voltage 10Hz-100kHz, COUT=100µF 50 µV rms Output Bypass Capacitor ESR=0.1 to 10Ω 10 µF Maximum Operational Input Voltage 25 28 V Maximum Line Transient RL=500Ω, VO≤5.5V,T=1ms, τ≤100ms 35 40 V Reverse Polarity Input Voltage,D/C -35 -40 V Reverse Polarity Input Voltage,Transient RL=500Ω, T=1ms, τ≤100ms -35 -40 V Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: To ensure constant junction temperature, low duty cycle pulse testing is used. Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ = 25°C. Note 4: The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to ambient thermal resistance θJ-A and the ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is calculated using: P(MAX)=(Tjmax-TA)/(θJ-A) SPICE MODEL AMS3107N-3.3V spice model pending. CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V GENERAL DIE INFORMATION Substrate Thickness [mils] Size LxW[mils] Bonding pads dimensions per drawing Backside Silicon Si 10±2 101.18x61.8±1 [2.57x1.57±0.025] Type Pad metal Thickness Assembly -FC TiW/Au 4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1 Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process: -FC -GB -GT -AN SMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR SMS3107N-3.3V AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR wire bonding SMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATORthermosonic SMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATORthermal SMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATORsolder reflow SMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR APPLICATION HINTS APPLICATION NOTES Definition of Terms Dropout Voltage: The input-output voltage differential at which the circuit stops to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100mV from the nominal voltage obtained at 1V input, dropout voltage is dependent upon load current and junction temperature. Input Voltage: The DC voltage applied to the input terminal with respect to ground. Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated output voltage for which the regulator will regulate. Line Regulation: The change in output voltage for a change in the input voltage. The line regulation is measured under conditions of low dissipation or by using low duty cycle pulse testing such that the average chip temperature is not significantly affected. Load Regulation: The change in output voltage for a change in load current at constant chip temperature. Long term stability: Output voltage stability under accelerated life-test conditions after 1000 hours with maximum rated voltage and junction temperature. Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range. Quiescent Current: That part of the positive input current that does not contribute to the positive load current. The regulator ground lead current. Ripple Rejection: The ratio of the peak-to -peak input ripple voltage to the peak-to-peak output ripple voltage at specified frequency. Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room temperature to either temperature extreme. External capacitor The SMS3107 series require an output capacitor of 2.2µF or greater to ensure device stability. Without the capacitor the device may oscillate. Most type of tantalum or electrolytic capacitor can be used in the applications. A critical characteristic of the capacitors is an ESR value of 5Ω or less and a resonant frequency above 500kHz. The value of this capacitor can be increased without limits. For higher loads, the value of the capacitor should be increased, specially when the output voltage is set for 2.5V or less. The SMS3107 lowest fixed output voltage value is 2.0V. Minimum Load In circuits using the fixed output voltage versions, minimum load is not required. For circuits using the adjustable device, the value of R1 and R2 should be chosen such, that a current of approximately 40?A flows through the network. The reference voltage (1.235V) is measured between the adjust pin and VOUT. The output voltage can be set by the two resistors R1 and R2 using the following equation: Vout=Vref(1+R12/R2) The value of R1 is recommended to be between 25kΩ to 30kΩ, and the value of R2 will set the output voltage. Typical Application - Adjustable Output Figure 1: Typical Application - Adjustable Output SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process. Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications. Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Flip chip SMS3107N-3.3V-FC -WP 1000 -FF 1000 Flip chip SMS3107N-3.3V-FC -WP 5000 -FF 5000 Gold Bump SMS3107N-3.3V-GB -WP 1000 -FF 1000 Gold Bump SMS3107N-3.3V-GB -WP 5000 -FF 5000 Gold-Tin SMS3107N-3.3V-GT -WP 1000 -FF 1000 Gold-Tin SMS3107N-3.3V-GT -WP 5000 -FF 5000 Gold/Nickel SMS3107N-3.3V-AN -WP 1000 -FF 1000 Gold/Nickel SMS3107N-3.3V-AN -WP 5000 -FF 5000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: 1 Color quality: 16 bit Color quality: bit © 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.

REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP

   
semiconix semiconductor - where the future is today - gold chip technology SMS3107N-3.3V - FLIP CHIP
GOLD CHIP TECHNOLOGY™ 500mA LOW DROPOUT VOLTAGE REGULATOR

FEATURES APPLICATIONS 500mA Low Drop Voltage Regulators - FLIP CHIP
Fixed and Adjustable Versions Available
Output Current in excess of 300mA
Very Low Quiescent Current
Reverse Battery Protection
Input-output Differential less than 0.6V
Short Circuit Protection
Internal Thermal Overload Protection
Load Dump Protection
Overvoltage Protection
Mirror Image Insertion Protection
High reliability
Unique new design in 1206 style case
Gold metallization
RoHS compliant, Lead Free
Compatible with both chip and wire, flip chip and surface mount assembly.
Cellular Telephones
Portable Consumer Equipment
Portable (Notebook) Computers
Battery Powered Systems
Portable Instrumentation
Radio Control Systems
CD/DVD drives
Automotive
Low Voltage Systems
MP3 Player
Chip on Board
System in package SIP
Hybrid Circuits
SMS3107N-3.3V AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR

500mA LOW DROPOUT VOLTAGE REGULATOR - PRODUCT DESCRIPTION
SMS3107 series consists of positive fixed and adjustable voltage regulators ideally suited for use in battery-powered systems. These devices feature very low quiescent current of 0.8mA or less when supplying 50mA loads. This unique characteristic and the extremely low input-output differential required for proper regulation (0.2V for output currents of 100mA) make the SMS3107 ideal to use for standby power systems. Internal circuitry of SMS3107 is protected from input fault conditions caused by reverse battery installation or input voltages that exceed maximum rated input voltage. During line transients, such as load dump (40V) when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both internal circuits and the load. The SMS3107 series also includes internal current limiting, thermal shutdown, and is able to withstand temporary power-up with mirror-image insertion. The SMS3107 is offered in the 3-pin TO-92 package, SOT-89, SOT-223, TO-252 and 8 lead SOIC packages and operates over the industrial temperature range.
Flip Chip Low Drop Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.

ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated)
Parameter Symbol Value Unit
Power Dissipation Internally limited
Operating Voltage Range 25 V
Overvoltage Protection 26V to 40V
Storage Temperature -65 to +150 °C
Operating Junction Temperature -40 to +125 °C

Electrical Characteristics* at VIN=6.3V, IO=5mA, TJ=25°C, C2=22µF unless otherwise specified.
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Output Voltage Tolerance -3 3 %
Line Regulation 6V≤VIN≤15V 5 10 mV
Line Regulation 15V≤VIN≤25V 5 15 mV
Load Regulation 5mA≤IO≤100 mA 5 15 mV
Load Regulation 5mA≤10≤200 mA 15 20 mV
Load Regulation 5mA≤10≤350 mA 20 25 mV
Load Regulation 5mA≤10≤500 mA 20 30 mV
Dropout Voltage (VIN - VOUT) IO=100 mA 0.25 0.3 mV
Dropout Voltage (VIN - VOUT) IO=200 mA 0.4 0.5 mV
Dropout Voltage (VIN - VOUT) IO=350 mA 0.45 0.55 mV
Dropout Voltage (VIN - VOUT) IO=500 mA 0.55 0.7 mV
Quiescent Current IO≤10 mA, 0.2 0.3 mA
Quiescent Current IO=100 mA 2 3 mA
Quiescent Current IO≤200 mA 5 8 mA
Quiescent Current IO=350 mA 12 mA
Shutdown Quiescent Current,over the full operating temperature range. 80 dB
Output Noise Voltage 10Hz-100kHz, COUT=100µF 50 µV rms
Output Bypass Capacitor ESR=0.1 to 10Ω 10 µF
Maximum Operational Input Voltage 25 28 V
Maximum Line Transient RL=500Ω, VO≤5.5V,T=1ms, τ≤100ms 35 40 V
Reverse Polarity Input Voltage,D/C -35 -40 V
Reverse Polarity Input Voltage,Transient RL=500Ω, T=1ms, τ≤100ms -35 -40 V
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ =
25°C.
Note 4: The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to ambient thermal resistance θJ-A
and the ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is calculated using:
P(MAX)=(Tjmax-TA)/(θJ-A)
SPICE MODEL
Spice model pending.
CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Size
LxW[mils]
Bonding pads dimensions per drawing Backside
Silicon
Si
10±2 101.18x61.8±1
[2.57x1.57±0.025]
TypePad metalThicknessAssembly
-FCTiW/Au4µm±1Wire bonding or Silver epoxy
-GBTiW/Au25µm±2.5Thermosonic
-GTTi/Pt/AuSn5µm±1Reflow
-ANNi/Au5µm±1Solder reflow
Optional backside coating and/or marking.

LAYOUT / DIMENSIONS / PAD LOCATIONS
Click to select process: -FC -GB -GT -AN
SMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR SMS3107N-3.3V AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR
wire bonding SMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V, AMS Advanced Monolithic Systems AMS3107N-3.3V AMS Advanced Monolithic Systems AMS3107N-3.3V 500mA LOW DROPOUT VOLTAGE REGULATOR

APPLICATION HINTS

APPLICATION NOTES 


Definition of Terms

Dropout Voltage: The input-output voltage differential at which the circuit stops to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100mV from the nominal voltage obtained at 1V input, dropout voltage is dependent upon load current and junction temperature.
Input Voltage: The DC voltage applied to the input terminal with respect to ground.
Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated output voltage for which the regulator will regulate.
Line Regulation: The change in output voltage for a change in the input voltage. The line regulation is measured under conditions of low dissipation or by using low duty cycle pulse testing such that the average chip temperature is not significantly affected.
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.
Long term stability: Output voltage stability under accelerated life-test conditions after 1000 hours with maximum rated voltage and junction temperature.
Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range.
Quiescent Current: That part of the positive input current that does not contribute to the positive load current. The regulator ground lead current.
Ripple Rejection: The ratio of the peak-to -peak input ripple voltage to the peak-to-peak output ripple voltage at specified frequency.
Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room temperature to either temperature extreme.

External capacitor

The SMS3107 series require an output capacitor of 2.2µF or greater to ensure device stability. Without the capacitor the device may oscillate.
Most type of tantalum or electrolytic capacitor can be used in the applications. A critical characteristic of the capacitors is an ESR value of 5Ω or
less and a resonant frequency above 500kHz. The value of this capacitor can be increased without limits. For higher loads, the value of the capacitor should
be increased, specially when the output voltage is set for 2.5V or less. The SMS3107 lowest fixed output voltage value is 2.0V.


Minimum Load

In circuits using the fixed output voltage versions, minimum load is not required. For circuits using the adjustable device, the value of R1 and R2 should
be chosen such, that a current of approximately 40?A flows through the network. The reference voltage (1.235V) is measured between the adjust pin and VOUT.
The output voltage can be set by the two resistors R1 and R2 using the following equation:
Vout=Vref(1+R12/R2)
The value of R1 is recommended to be between 25kΩ to 30kΩ, and the value of R2 will set the output voltage.


Typical Application - Adjustable Output
Figure 1: Typical Application - Adjustable Output

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process.
Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications.
Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc.
Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages.

STANDARD PRODUCTS ORDERING INFORMATION

VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($)
Flip chip SMS3107N-3.3V-FC -WP 1000 -FF 1000
Flip chip SMS3107N-3.3V-FC -WP 5000 -FF 5000
Gold Bump SMS3107N-3.3V-GB -WP 1000 -FF 1000
Gold Bump SMS3107N-3.3V-GB -WP 5000 -FF 5000
Gold-Tin SMS3107N-3.3V-GT -WP 1000 -FF 1000
Gold-Tin SMS3107N-3.3V-GT -WP 5000 -FF 5000
Gold/Nickel SMS3107N-3.3V-AN -WP 1000 -FF 1000
Gold/Nickel SMS3107N-3.3V-AN -WP 5000 -FF 5000

PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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